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ZTX750 데이터시트(Datasheet) 1 Page - Foshan Blue Rocket Electronics Co.,Ltd.

부품명 ZTX750
상세내용  Silicon PNP transistor in a TO-92 Plastic Package
PDF  6 Pages
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제조사  FOSHAN [Foshan Blue Rocket Electronics Co.,Ltd.]
홈페이지  http://www.fsbrec.com/
Logo 

   
 1 page
background image
ZTX750
Rev.E Mar.-2016
DATA SHEET
http://www.fsbrec.com
1 / 6
TO-92 塑封封装 PNP 半导体三极管。Silicon PNP transistor in a TO-92 Plastic Package.
高集电极直流电流和集电极耗散功率。
High PC and IC.
用于中功率放大。
Medium power amplifier applications.
PIN1
:Collector
PIN 2
:Base
PIN 3
:Emitter
放大及印章代码 / hFE Classifications & Marking
见印章说明。See Marking Instructions.
描述 / Descriptions
特征 / Features
用途 / Applications
内部等效电路 / Equivalent Circuit
引脚排列 / Pinning
1 2
3
 2 page
background image
ZTX750
Rev.E Mar.-2016
DATA SHEET
http://www.fsbrec.com
2 / 6
参数
Parameter
符号
Symbol
数值
Rating
单位
Unit
Collector to Base Voltage
VCBO
-60
V
Collector to Emitter Voltage
VCEO
-45
V
Emitter to Base Voltage
VEBO
-5.0
V
Collector Current - Continuous
IC
-2.0
A
Peak Collector Current- Continuous
ICM
-6.0
A
Collector Power Dissipation
PC
1.0
W
Junction Temperature
Tj
150
Storage Temperature Range
Tstg
-55~150
参数
Parameter
符号
Symbol
测试条件
Test Conditions
最小值
Min
典型值
Typ
最大值
Max
单位
Unit
Collector to Base Breakdown
Voltage
VCBO
IC=-100μA
-60
V
Collector to Emitter Breakdown
Voltage
VCEO
IC=-10mA
-45
V
Emitter to Base Breakdown
Voltage
VEBO
IE=-100μA
-5.0
V
Collector Cut-Off Current
ICBO
VCB=-45V
IE=0
-0.1
μA
Emitter Cut-Off Current
IEBO
VEB=-4.0V
IC=0
-0.1
μA
DC Current Gain
hFE
IC=-500mA
VCE=-2.0V
100
300
Collector to Emitter Saturation
Voltage
VCE(sat)(1)
IC=-1.0A
IB=-100mA
-0.15
-0.3
V
VCE(sat)(2)
IC=-2.0A
IB=-200mA
-0.28
-0.5
V
Base to Emitter Saturation
Voltage
VBE(sat)
IC=-1.0A
IB=-100mA
-0.9
-1.25
V
Transition Frequency
fT
VCE=-5.0V
IC=-100mA
f=100MHz
100
140
MHz
Output Capacitance
Cob
VCB=-10V
f=1.0MHz
30
pF
Turn-On Time
Ton
VCC=-10V
IC=-500mA
IB1=IB2=-50mA
40
ns
Turn-Off Time
Toff
VCC=-10V
IC=-500mA
IB1=IB2=-50mA
450
ns
极限参数 / Absolute Maximum Ratings(Ta=25℃)
电性能参数 / Electrical Characteristics(Ta=25℃)
 3 page
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ZTX750
Rev.E Mar.-2016
DATA SHEET
http://www.fsbrec.com
3 / 6
电参数曲线图 / Electrical Characteristic Curve
 4 page
background image
ZTX750
Rev.E Mar.-2016
DATA SHEET
http://www.fsbrec.com
4 / 6
外形尺寸图 / Package Dimensions
 5 page
background image
ZTX750
Rev.E Mar.-2016
DATA SHEET
http://www.fsbrec.com
5 / 6
印章说明 / Marking Instructions
说明:
BR:  

为公司代码
X750: 
为型号代码
****:

为生产批号代码,随生产批号变化。
Note:
BR:
Company Code.
X750:

Product Type.
****:
Lot No. Code,code change with Lot No.
BR
****
X750
 6 page
background image
ZTX750
Rev.E Mar.-2016
DATA SHEET
http://www.fsbrec.com
6 / 6
波峰焊温度曲线图(无铅) / Temperature Profile for Dip Soldering(Pb-Free)
说明:
Note:
1
、预热温度 25~150℃,时间 60~90sec;
1.Preheating:25~150
℃, Time:60~90sec.
2
、峰值温度 255±5℃,时间持续为 5±0.5sec;
2.Peak Temp.:255
±5℃, Duration:5±0.5sec.
3
、焊接制程冷却速度为 2~10℃/sec.
3. Cooling Speed: 2~10
℃/sec.
耐焊接热试验条件 /
Resistance to Soldering Heat Test Conditions
温度:270±5℃
时间:10±1 sec.
Temp:270±5℃
Time:10±1 sec
包装规格 / Packaging SPEC.
散件包装 / BULK
Package Type
封装形式
Units 包装数量
Dimension 包装尺寸 (unit:mm3)
Units/Bag
/袋
Bags/Inner Box
/盒
Units/Inner Box
/盒
Inner Boxes/Outer Box
/箱
Units/Outer Box
/箱
Bag 袋
Inner Box 盒
Outer Box 箱
TO-92
1,000
10
10,000
5
50,000
135×190
237×172×102
560×245×195
1,000
10
10,000
10
100,000
135×190
237×172×102
560×245×375
编带包装 / AMMO
Package Type
封装形式
Units 包装数量
Dimension 包装尺寸 (unit:mm3)
Units/tape
/纸带
Tape/Inner Box
纸带
/盒
Rows/Inner Box
纸带层
/盒
Inner Boxes/Outer Box
/箱
Units/Outer Box
/箱
Inner Box 盒
Outer Box 箱
TO-92
3,000
1
120
10
30,000
328×230×42
小箱
480×346×235,
大箱
547×407×268
使用说明 / Notices




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