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SLGC55545 데이터시트(PDF) 4 Page - Dialog Semiconductor

부품명 SLGC55545
상세설명  USB Charging Port Power Switch and Controller
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000-000C55545-101
Page 4 of 20
SLGC55545
1. For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report,
SPRA953.
2. The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K
board, as specified in JESD51-7, in an environment described in JESD51-2a.
3. The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific
JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
4. The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control
the PCB temperature, as described in JESD51-8.
5. The junction-to-top characterization parameter,
ψJT, estimates the junction temperature of a device in a real system and is
extracted from the simulation data for obtaining
θJA, using a procedure described in JESD51-2a (sections 6 and 7).
6. The junction-to-board characterization parameter,
ψJB, estimates the junction temperature of a device in a real system and is
extracted from the simulation data for obtaining
θJA, using a procedure described in JESD51-2a (sections 6 and 7).
7. The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No
specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Thermal Information1
Parameter
Typical
Unit
θJA
Junction-to-ambient thermal resistance 2
53.4
°C/W
θJCtop
Junction-to-case (top) thermal resistance 3
51.4
°C/W
θJB
Junction-to-board thermal resistance 4
17.2
°C/W
ψJT
Junction-to-top characterization parameter 5
3.7
°C/W
ψJB
Junction-to-board characterization parameter 6
20.7
°C/W
θJCbot
Junction-to-case (bottom) thermal resistance 7
3.9
°C/W
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Symbol
Parameter
Condition/Note
Min.
Typ.
Max.
Unit
VIN
Input Voltage
VIN
4.5
--
5.5
V
Logic Level Inputs (CTL1, CTL2,
CTL3, EN, ILIM_SEL)
0
--
5.5
V
Data Line Inputs (DP_IN,
DM_IN, DP_OUT, DM_OUT)
--
--
5.5
V
Continuous Current
Data Line inputs (SDP or CDP
mode, DP_IN to DP_OUT or
DM_IN to DM_OUT)
--
--
±30
mA
Data Line inputs (BC1.2 DCP
mode, DP_IN to DM_IN)
--
--
±15
mA
RILIM
Current-limit set resistors
ILIM_L to GND, ILIM_H to GND
16.9
--
750
k
Ω
TJ
Operating virtual junction
temperature
-40
--
125
°C
VIH
Input Logic High
1.8
--
--
V
VIL
Input Logic Low
--
--
0.8
V
VHYST
Input Logic Hysteresis
--
250
--
mV


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