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TS68332MR16 데이터시트(PDF) 9 Page - ATMEL Corporation

부품명 TS68332MR16
상세설명  High performance 32-bit integrated microcontroller
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제조업체  ATMEL [ATMEL Corporation]
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TS68332
2118A–HIREL–03/02
Power Considerations
The average chip-junction temperature, T
J, in °C can be obtained from:
T
J = TA + (PD ⋅ θJA)
(1)
T
A = Ambient Temperature, °C
θ
JA = Package Thermal Resistance, Junction-to-Ambient, °C/W
P
D = PINT + PI/O
P
INT = ICC ⋅ VCC, Watts - Chip Internal Power
P
I/O = Power Dissipation on Input and Output Pins - User Determined
For most applications P
I/O < PINT and can be neglected.
An approximate relationship between P
D and TJ (if PI/O is neglected) is:
P
D = K ÷ (TJ + 273)
(2)
Solving equations (1) and (2) for K gives:
K = P
D ⋅ (TA + 273) + θJA ⋅ PD
2
(3)
where K is a constant pertaining to the particular part K can be determined from equa-
tion (3) by measuring P
D (at equilibrium) for a known TA. Using this value of K, the
values of P
D and TJ can be obtained by solving equations (1) and (2) iteratively for any
value of T
A.
Table 2. Absolute Maximum Ratings
Symbol
Parameter
Test Conditions
Min
Max
Unit
V
DD
Supply Voltage
-0.3
+7.0
V
V
I
Input Voltage
-0.3
+7.0
V
PDMAX
Max Power Dissipation
Low Power Operation
600
mW
Stand By Mode
500
mW
T
case
Operating Temperature
M Suffix
-55
+125
°C
V Suffix
-40
+85
°C
T
stg
Storage Temperature
-55
+150
°C
T
leads
Lead Temperature
Max 5 Sec. Soldering
+270
°C
Table 3. Thermal Characteristics (at 25°C)
Package
Symbol
Parameter
Value
Unit
PGA 132
θ
J-A
Thermal Resistance Ceramic Junction-to-ambient
TBD
°C/W
θ
J-C
Thermal Resistance Ceramic Junction-to-case
10
°C/W
CERQUAD 132
θ
J-A
Thermal Resistance Ceramic Junction-to-ambient
TBD
°C/W
θ
J-C
Thermal Resistance Ceramic Junction-to-case
10
°C/W


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