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LTM4634 데이터시트(PDF) 2 Page - Linear Technology |
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LTM4634 데이터시트(HTML) 2 Page - Linear Technology |
2 / 32 page LTM4634 2 4634f For more information www.linear.com/LTM4634 pin conFiguraTion absoluTe MaxiMuM raTings CNTL_PWR ............................................... –0.3V to 30V VIN1, VIN2, VIN3........................................... –0.3V to 30V VOUT1, VOUT2........................................... –0.3V to 5.75V VOUT3......................................................... –0.3V to 14V Switch Voltage (SW1, SW2 and SW3) ...........–1V to 30V MODE/PLLIN, TK/SS1, TK/SS2, TK/SS3, FREQ/PLLLPF .......................................–0.3V to INTVCC COMP1, COMP2, COMP3, VFB1, VFB2, VFB3 (Note 3).................................................–0.3V to INTVCC RUN1, RUN2, RUN3, INTVCC, EXTVCC, PGOOD12, PGOOD3..................................... –0.3V to 6V TEMP1, TEMP2......................................... –0.3V to 0.8V INTVCC Peak Output Current................................100mA Operating Junction Temperature Range (Note 2).................................................. –40°C to 125°C Storage Temperature Range .................. –55°C to 125°C Peak Solder Reflow Body Temperature ................. 245°C (Note 1) 1 A B C D E F SW3 TEMP2 G H J K L M GND TKSS2 TK/SS1 TK/SS3 VFB3 VFB2 VFB1 FREQ/PLLLPF SGND VIN1 SW1 SW2 VIN2 VIN3 VOUT3 TOP VIEW BGA PACKAGE 144 LEAD (15mm × 15mm × 5.01mm) VOUT2 VOUT1 GND GND COMP3 COMP2 COMP1 PGOOD12 PGOOD3 EXTVCC GND GND GND GND GND 2 3 4 5 6 7 8 9 10 11 12 TEMP1 INTVCC CNTL_PWR MODE/PLLIN RUN1 RUN2 RUN3 TJMAX = 125°C, θJA = 7.5°C/W, θJCbottom = 4°C/W, θJCtop = 5°C/W θJA DERIVED FROM 95mm × 76mm PCB WITH 4-LAYER, WEIGHT = 3.2g θ VALUES DETERMINED PER JESD51-12 orDer inForMaTion PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE TYPE MSL RATING TEMPERATURE RANGE (See Note 2) DEVICE FINISH CODE LTM4634EY#PBF SAC305 (RoHS) LTM4634Y e1 BGA 4 –40°C to 125°C LTM4634IY#PBF SAC305 (RoHS) LTM4634Y e1 BGA 4 –40°C to 125°C LTM4634IY SnPb (63/37) LTM4634Y e0 BGA 4 –40°C to 125°C Consult Marketing for parts specified with wider operating temperature ranges. *Device temperature grade is indicated by a label on the shipping container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • Terminal Finish Part Markings: www.linear.com/leadfree • Recommended LGA and BGA PCB Assembly and Manufacturing Procedures: www.linear.com/umodule/pcbassembly • LGA and BGA Package and Tray Drawings: www.linear.com/packaging |
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