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L6225PD 데이터시트(PDF) 4 Page - STMicroelectronics |
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L6225PD 데이터시트(HTML) 4 Page - STMicroelectronics |
4 / 10 page L6225 4/10 PIN DESCRIPTION THERMAL DATA Name PowerSO20 PowerDIP20/ SO20 Function VSA 2 17 Supply Voltage of the Bridge A. VSB 19 14 Supply Voltage of the Bridge B. This pin must be connected to VSA. OUT1A OUT2A 9 3 4 18 Bridge A outputs. OUT1B OUT2B 12 18 7 13 Bridge B outputs. SENSEA 8 3 Sense resistor for the bridge A SENSEB 13 8 Sense resistor for the bridge B GND 1,10,11,20 5, 6,15,16 Common ground terminals. In Powerdip and SO packages, these pins are also used for heat dissipation toward the PCB. ENA 5 20 Enable of the Bridge A. A LOW logic level applied to this pin switches off all the power DMOSs of the related bridge. The Bridge A over current protection open drain is internally connected to this pin. ENB 16 11 Enable of the Bridge B. A LOW logic level applied to this pin switches off all the power DMOSs of the related bridge. The Bridge B over current protection open drain is internally connected to this pin. IN1A IN2A 6 7 1 2 Logic inputs of the Bridge B. Provided the ENA signal is HIGH, a HIGH logic level applied to any of these pins switches on the related high side power DMOS, while a logic LOW switches on the related low side power DMOS . IN1B IN2B 14 15 9 10 Logic inputs of the Bridge B. Provided the ENB signal is HIGH, a HIGH logic level applied to any of these pins switches on the related high side power DMOS, while a logic LOW switches on the related low side power DMOS . VCP 4 19 Bootstrap Oscillator. Oscillator output for the external charge pump. VBOOT 17 12 Supply voltage to overdrive the upper DMOSs. Symbol Description PowerDIP20 SO20 PowerSO20 Unit Rth-j-pins MaximumThermal Resistance Junction-Pins 13 15 - °C/W Rth-j-case Maximum Thermal Resistance Junction-Case - - 2 °C/W Rth-j-amb1 MaximumThermal Resistance Junction-Ambient (1) (1) Mounted on a multilayer FR4 PCB with a dissipating copper surface on the bottom side of 6 cm2 (with a thickness of 35 µm). 41 51 - °C/W Rth-j-amb1 Maximum Thermal Resistance Junction-Ambient (2) (2) Mounted on a multilayer FR4 PCB with a dissipating copper surface on the top side of 6 cm2 (with a thickness of 35 µm). -- 36 °C/W Rth-j-amb1 MaximumThermal Resistance Junction-Ambient (3) (3) Mounted on a multilayer FR4 PCB with a dissipating copper surface on the top side of 6 cm2 (with a thickness of 35 µm), 16 via holes and a ground layer. -- 16 °C/W Rth-j-amb2 Maximum Thermal Resistance Junction-Ambient (4) (4) Mounted on a multiplayer PCB without any heatsinking surface on the board. 57 78 63 °C/W |
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