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NBSG16MN 데이터시트(PDF) 2 Page - ON Semiconductor

부품명 NBSG16MN
상세설명  2.5V/3.3V SiGe Differential Receiver/Driver with RSECLOutputs
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제조업체  ONSEMI [ON Semiconductor]
홈페이지  http://www.onsemi.com
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NBSG16
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Figure 1. BGA-16 Pinout (Top View)
VEE
D
D
VTD
VEE
VBB
VTD
NC
NC
VEE
VCC
VCC
VMM
VEE
Q
Q
A
B
C
D
12
3
4
VEE
NC
NC
VEE
VEE VBB VMM VEE
VCC
Q
Q
VCC
VTD
D
D
VTD
56
7
8
16
15
14
13
12
11
10
9
1
2
3
4
NBSG16
Exposed Pad (EP)
Figure 2. QFN-16 Pinout (Top View)
Table 1. Pin Description
Pin
BGA
QFN
Name
I/O
Description
C2
1
VTD
-
Internal 50
W Termination Pin. See Table 2.
C1
2
D
ECL, CML,
LVCMOS, LVDS,
LVTTL Input
Inverted Differential Input. Internal 75 k
W to VEE and 36.5 kW to VCC.
B1
3
D
ECL, CML,
LVCMOS, LVDS,
LVTTL Input
Noninverted differential input. Internal 75 k
W to VEE.
B2
4
VTD
-
Internal 50
W Termination Pin. See Table 2.
A1,D1,A4,
D4
5,8,13,16
VEE
-
Negative Supply Voltage
A2,A3
6,7
NC
-
No Connect
B3,C3
9,12
VCC
-
Positive Supply Voltage
B4
10
Q
RSECL Output
Noninverted Differential Output. Typically Terminated with 50
W to
VTT = VCC - 2 V
C4
11
Q
RSECL Output
Inverted Differential Output. Typically Terminated with 50
W to VTT = VCC - 2 V
D3
14
VMM
-
LVCMOS Reference Voltage Output. (VCC - VEE)/2
D2
15
VBB
-
ECL Reference Voltage Output
N/A
-
EP
-
Exposed Pad. (Note 2)
1. The NC pins are electrically connected to the die and MUST be left open.
2. All VCC and VEE pins must be externally connected to Power Supply to guarantee proper operation. The thermally exposed pad on package
bottom (see case drawing) must be attached to a heat-sinking conduit.
3. In the differential configuration when the input termination pins (VTD, VTD) are connected to a common termination voltage, and if no signal
is applied then the device will be susceptible to self-oscillation.


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