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ETC |
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6 page
MEMSIC MXD7210GL/HL/ML/NL Page 6 of 10 2003.08.04 POWER SUPPLY NOISE REJECTION One capacitor is recommended for best rejection of power supply noise (reference Figure 5 below). The capacitor should be located as close as possible to the device supply pin (VDD). The capacitor lead length should be as short as possible, and surface mount capacitor is preferred. For typical applications, the capacitor can be ceramic 0.1 µF. PCB LAYOUT AND FABRICATION SUGGESTIONS 1. Liberal use of ceramic bypass capacitors is recommended. 2. Robust low inductance ground wiring should be used. 3. Care should be taken to ensure there is “thermal symmetry” on the PCB immediately surrounding the MEMSIC device and that there is no significant heat source nearby. 4. A metal ground plane should be added directly beneath the MEMSIC device. The size of the plane should be similar to the MEMSIC device’s footprint and be as thick as possible. 5. Vias can be added symmetrically around the ground plane. Vias increase thermal isolation of the device from the rest of the PCB. Figure 5: Power Supply Noise Rejection |
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