전자부품 데이터시트 검색엔진 |
|
GRM21A7U2D121JW31 데이터시트(PDF) 15 Page - Murata Manufacturing Co., Ltd. |
|
GRM21A7U2D121JW31 데이터시트(HTML) 15 Page - Murata Manufacturing Co., Ltd. |
15 / 28 page 4-1.Reflow Soldering 1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering] mechanical strength of the components will decrease because a sudden temperature change causes deformation inside the components. In order to prevent mechanical damage to the components, preheating is required for both the components and the PCB. Preheating conditions are shown in table 1. It is required to keep the temperature differential between the solder and the components surface (ΔT) as small as possible. 2. When components are immersed in solvent after mounting, be sure to maintain the temperature difference (ΔT) between the component and the solvent within the range shown in the table 1. [Allowable Reflow Soldering Temperature and Time] Table 1 In the case of repeated soldering, the accumulated soldering time must be within the range shown above. Recommended Conditions Lead Free Solder : Sn-3.0Ag-0.5Cu 3. When a capacitor is mounted at a temperature lower than the peak reflow temperature recommended by the solder manufacturer, the following quality problems can occur. Consider factors such as the placement of peripheral components and the reflow temperature setting to prevent the capacitor’s reflow temperature from dropping below the peak temperature specified. Be sure to evaluate the mounting situation beforehand and verify that none of the following problems occur. ・Drop in solder wettability ・Solder voids ・Possible occurrence of whiskering ・Drop in bonding strength ・Drop in self-alignment properties ・Possible occurrence of tombstones and/or shifting on the land patterns of the circuit board 4. Optimum Solder Amount for Reflow Soldering 4-1. Overly thick application of solder paste results in a excessive solder fillet height. This makes the chip more susceptible to mechanical and thermal stress on the board and may cause the chips to crack. 4-2. Too little solder paste results in a lack of adhesive strength on the termination, which may result in chips breaking loose from the PCB. 4-3. Please confirm that solder has been applied smoothly to the termination. Make sure not to impose any abnormal mechanical shocks to the PCB. Atmosphere Air or N2 Inverting the PCB GR□ 32/42/43/52/55 ΔT≦130℃ Lead Free Solder Peak Temperature 240 to 260℃ Caution Series Chip Dimension(L/W) Code Temperature Differential GR□ 18/21/31 ΔT≦190℃ ! Soldering Time(s) 280 270 260 250 240 230 220 0 30 60 120 90 Temperature(℃) Peak Temperature Soldering Gradual Cooling Preheating ΔT 60-120 seconds 30-60 seconds Time 190℃ 170℃ 150℃ 220℃ JEMCGC-05049F 15 |
유사한 부품 번호 - GRM21A7U2D121JW31 |
|
유사한 설명 - GRM21A7U2D121JW31 |
|
|
링크 URL |
개인정보취급방침 |
ALLDATASHEET.CO.KR |
ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |