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CD4053B 데이터시트(PDF) 1 Page - Silicon Supplies |
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CD4053B 데이터시트(HTML) 1 Page - Silicon Supplies |
1 / 6 page CMOS High Voltage Logic – CD4053B Triple 2-Channel Analog Multiplexer/Demultiplexer in bare die form Rev 1.0 08/09/18 The CD4053B is a digitally controlled Analog Switch consisting of x3 separate digital control inputs, A, B, & C plus inhibit input. Each control input selects one of a pair of channels in SPDT configuration. Logic “1” at the inhibit input switches all channels off. Logic-level conversion of analog signals up to 18VP-P is achieved via digital signal amplitudes of 4.5V to 18V (if VDD-VSS = 3V, a VDD-VEE up to 13V can be controlled; for VDD- VEE level differences >13V, VDD-VSS ≥ 4.5V is required). Featuring low ON impedance & very low OFF leakage current, quiescent power consumption is extremely low across the full VDD-VSS & VDD-VEE range and independent of control logic state. Description Break-before-make switch function eliminates channel overlap Supply voltage range: 3V to 18V Analog voltage range (VDD - VEE) : 3V to 18V ON resistance: 125Ω (typ) over 15VP-P signal Channel leakage current: 100 nA ,VDD = 18V Matched Switch Characteristics: RON = 10Ω (max), VDD - VEE = 15V Quiescent current : 0.2 μA, VDD = 15V Binary address decoding on-chip Features: The following part suffixes apply: Ordering Information Die Dimensions in µm (mils) 2057 (81) No suffix - MIL-STD-883 /2010B Visual Inspection “H” - MIL-STD-883 /2010B Visual Inspection + MIL-PRF-38534 Class H LAT “K” - MIL-STD-883 /2010A Visual Inspection (Space) + MIL-PRF-38534 Class K LAT LAT = Lot Acceptance Test. For further information on LAT process flows see below. www.siliconsupplies.com\quality\bare-die-lot-qualification 2057 x 1850 Die Size (Unsawn) 81 x 89 µm mils 106 x 106 Minimum Bond Pad Size 4.17 x 4.17 µm mils Supply Formats: Mechanical Specification Default – Die in Waffle Pack (100 per tray capacity) Sawn Wafer on Tape – On request Unsawn Wafer – On request 635 (±20) µm Die Thickness 25 (±0.79) mils Die Thickness <> 635µm(25 Mils) – On request Assembled into Ceramic Package – On request Top Metal Composition Al 1%Si 1.1µm Back Metal Composition N/A – Bare Si Page 1 of 6 www.siliconsupplies.com |
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