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LM317MDT 데이터시트(PDF) 2 Page - ON Semiconductor |
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LM317MDT 데이터시트(HTML) 2 Page - ON Semiconductor |
2 / 16 page LM317M http://onsemi.com 2 MAXIMUM RATINGS (TA = 25°C, unless otherwise noted.) Rating Symbol Value Unit Input−Output Voltage Differential VI−VO 40 Vdc Power Dissipation (Package Limitation) (Note 1) Plastic Package, T Suffix, Case 221A TA = 25°C Thermal Resistance, Junction−to−Air Thermal Resistance, Junction−to−Case Plastic Package, DT Suffix, Case 369C TA = 25°C Thermal Resistance, Junction−to−Air Thermal Resistance, Junction−to−Case Plastic Package, ST Suffix, Case 318E TA = 25°C Thermal Resistance, Junction−to−Air Thermal Resistance, Junction−to−Case PD qJA qJC PD qJA qJC PD qJA qJC Internally Limited 70 5.0 Internally Limited 92 5.0 Internally Limited 245 15 °C/W °C/W °C/W °C/W °C/W °C/W Operating Junction Temperature Range TJ − 40 to +125 °C Storage Temperature Range Tstg − 65 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Figure 25 provides thermal resistance versus pc board pad size. |
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