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4 / 6 page SM6HT 4/6 Figure 7: Variation of thermal impedance junction to ambient versus pulse duration (Printed circuit board FR4 with recommended pad layout) Figure 8: Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board FR4, e(Cu)=35µm) Figure 9: Variation of leakage current versus junction temperature (typical values) 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 1E-1 1E+0 1E+1 1E+2 Z (°C/W) th(j-a) t (ms) p 012345 40 50 60 70 80 90 100 R (°C/W) th(j-a) S(cm²) 25 50 75 100 125 150 175 1E-1 4E-2 1E+0 2E+0 I (µA) R T (°C) j |
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