전자부품 데이터시트 검색엔진 |
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S-19213 데이터시트(PDF) 36 Page - ABLIC Inc. |
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S-19213 데이터시트(HTML) 36 Page - ABLIC Inc. |
36 / 46 page (1) 1 2 3 4 (2) 1 2 3 4 (3) 1 2 3 4 Board A Board B Board C Thermal via Number: 4 Diameter: 0.3 mm Number of copper foil layer 4 Copper foil layer [mm] Land pattern and wiring for testing: t0.070 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.070 Material FR-4 Thermal via - Item Specification Copper foil layer [mm] Land pattern and wiring for testing: t0.070 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.070 Size [mm] 114.3 x 76.2 x t1.6 Size [mm] 114.3 x 76.2 x t1.6 Material FR-4 Number of copper foil layer 4 Copper foil layer [mm] Land pattern and wiring for testing: t0.070 - - Item Specification 74.2 x 74.2 x t0.070 Size [mm] 114.3 x 76.2 x t1.6 Item Specification Thermal via - Material FR-4 Number of copper foil layer 2 IC Mount Area enlarged view HSOP-8A Test Board No. HSOP8A-A-Board-SD-1.0 ABLIC Inc. |
유사한 부품 번호 - S-19213 |
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유사한 설명 - S-19213 |
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