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FAN2559MP15X 데이터시트(PDF) 3 Page - Fairchild Semiconductor |
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FAN2559MP15X 데이터시트(HTML) 3 Page - Fairchild Semiconductor |
3 / 15 page PRODUCT SPECIFICATIONS FAN2558/FAN2559 REV. 1.0.4 3/15/04 3 Absolute Maximum Ratings Recommended Operating Conditions Notes: 1. Using Mil Std. 883E, method 3015.7 (Human Body Model) and EIA/JESD22C101-A (Charge Device Model) 2. Junction to ambient thermal resistance, ΘJC, is a strong function of PCB material, board thickness, thickness and number of copper plains, number of via used, diameter of via used, available copper surface, and attached heat sink characteristics. Parameter Min. Max. Units VIN to GND 6V Voltage on any other pin to GND -0.3 VIN + 0.3 V Junction Temperature (TJ) -55 150 °C Storage Temperature -65 150 °C Lead Soldering Temperature, 10 seconds 300 °C Power Dissipation (PD) Internally Limited W Electrostatic Discharge (ESD) Protection (Note1) HBM 4 kV CDM 1 Parameter Min. Typ. Max. Units Supply Voltage Range, VIN for VOUT < 2.0V 2.7 5.5 V Supply Voltage Range, VIN for VOUT ≥ 2.0V VOUT + VDROPOUT 5.5 V Load Current 180 mA Enable Input Voltage VEN 0VIN V Power Good Output Voltage Range VPG 0VIN V Junction Temperature -40 125 °C Thermal Resistance-Junction to Ambient SOT-23 (Note 2) 235 °C/W Thermal Resistance-Junction to Case, 2mm x 2mm 6-lead MLP 75 |
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