MEMSIC MXD7202GL/HL/ML/NL
Page 6 of 10
2003.08.04
POWER SUPPLY NOISE REJECTION
One capacitor is recommended for best rejection of power
supply noise (reference Figure 5 below). The capacitor
should be located as close as possible to the device supply
pin (VDD). The capacitor lead length should be as short as
possible, and surface mount capacitor is preferred. For
typical applications, the capacitor can be ceramic 0.1 µF.
PCB LAYOUT AND FABRICATION SUGGESTIONS
1. Liberal use of ceramic bypass capacitors is
recommended.
2. Robust low inductance ground wiring should be used.
3. Care should be taken to ensure there is “thermal
symmetry” on the PCB immediately surrounding the
MEMSIC device and that there is no significant heat
source nearby.
4. A metal ground plane should be added directly beneath
the MEMSIC device. The size of the plane should be
similar to the MEMSIC device’s footprint and be as
thick as possible.
5. Vias can be added symmetrically around the ground
plane. Vias increase thermal isolation of the device
from the rest of the PCB.
Figure 5: Power Supply Noise Rejection
