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March 2004
rev. 01
Zywyn Corporation
ZSP4422A
Zywyn
Block Diagram
Figure 1. Block Diagram
Pin Description
Pin Number
Pin Name
Pin Function
1
HON
Enable for driver operation: high = active; low = inactive.
2V
SS
Power supply common: connect to ground.
3
COIL
Coil input: connect coil from V
DD to this pin.
4
EL2
Lamp driver output 2: connect to EL lamp.
5
EL1
Lamp driver output 1: connect to EL lamp.
6V
DD
Power supply for driver: connect to system V
DD.
7
CAP1
Capacitor Input 1: connect to C
OSC.
8
CAP2
Capacitor Input 2: connect to C
OSC.
Bonding Diagram
Die Photo
Q
Q
VBATTERY
HON
VDD
FF1
FF2
EL Lamp
4
VDD
7
Coil
2
3
EL2
EL1
5
6
VSS
5mH/18
Ω
1
OSC
Cap1
C
OSC
= 100pF
fCOIL
fLAMP
fLAMP
HV
1
HV
2
Cap2
8
0.1
µF
CO IL
V
V
EL1
EL2
CAP1
CAP 2
HO N
Z S P 4422A
DD
SS
PA D
X
Y
E L 1
556.5
179.0
E L 2
556.2
-151.0
C O IL
-1 9.5
-517.0
H O N
-549.0
-256.5
C A P 2
-549.0
9 3.5
C A P 1
-568.0
-516.5
NO T E S :
1. Dimensions a re in microns unless othe rwise no ted.
2. Bonding pads a re 125x125 typical
3. Outside dimensions a re maximum , including sc ribe area.
4. Die thickness is 11 mils +/- 1.
5. Pad center coordinates are relative to die center.
6. Die subst rate d own-bonds to Vss (GND)
.
7. Die mask num ber is MS129.
8. Die size 1346 x 1447 ( 53 x 57 mils).
V
SS
-568.0
-517.0
V
DD
-349.0
517.0
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