전자부품 데이터시트 검색엔진 |
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LM27212 데이터시트(PDF) 8 Page - National Semiconductor (TI) |
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LM27212 데이터시트(HTML) 8 Page - National Semiconductor (TI) |
8 / 23 page Electrical Characteristics Specifications with standard typeface are for T J = 25˚C, and those in bold face type apply over a junction temperature range of -5˚C to +110˚C. Unless otherwise specified, VDD = 5V, SGND = DGND = SRCK1 = 0V. (Note 5) (Continued) Symbol Parameter Conditions Min Typ Max Units Power Good Mask For Dynamic Output Swing 100 133 179 µs Power Good De-assertion Delay Upon Shutdown Delay From VRON de-assertion to PGOOD de-assertion 90 ns Over-voltage Protection SENSE Voltage as a Percentage of VOVP VOVP = VREF 109 123 139 % System DE_EN# Input Logic Low-to-High Transition Threshold 0.63 V DE_EN# Input Logic High-to-Low Transition Threshold 0.315 V DE_EN# Pin Leakage Current DE_EN# = 7.5V 100 µA Soft Shutdown Finish Threshold 0.3 V Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is guaranteed. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics table. Functional temperature range is the range within which the device performs its intended functions, but not necessarily meeting the limits specified in the Electrical Characteristic table. Note 2: The maximum allowable power dissipation is calculated by using PDmax =(TJMAX -TA)/θJA , where TJMAX is the maximum junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance of the specified package. The 1.56W rating results from using 150˚C, 25˚C, and 80˚C/W for TJMAX,TA, and θJA respectively. The θJA of 90˚C/W represents the worst-case condition with no heat sinking of the 48-Pin TSSOP. Heat sinking allows the safe dissipation of more power. The Absolute Maximum power dissipation should be de-rated by 12.5mW per ˚C above 25˚C ambient. The LM27212 actively limits its junction temperature to about 150˚C. Note 3: For detailed information on soldering plastic small-outline packages, refer to the Packaging Databook available from National Semiconductor Corporation. Note 4: For testing purposes, ESD was applied using the human-body model, a 100pF capacitor discharged through a 1.5k Ω resistor. Note 5: All limits are guaranteed at room temperature (standard face type) and at temperature extremes (bold face type). All room temperature limits are 100% production tested. All limits at temperature extremes are guaranteed via correlation using Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). www.national.com 8 |
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