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AM29LV320ML101R 데이터시트(PDF) 6 Page - SPANSION

부품명 AM29LV320ML101R
상세설명  32 Megabit (2 M x 16-Bit/4 M x 8-Bit) MirrorBit 3.0 Volt-only Uniform Sector Flash Memory with VersatileI/O Control
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Am29LV320MH/L
December 14, 2005
DA TA SH EET
TABLE OF CONTENTS
Continuity of Specifications ....................................................... i
For More Information ................................................................. i
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 6
Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9
Device Bus Operations . . . . . . . . . . . . . . . . . . . . 10
Table 1. Device Bus Operations ..................................................... 10
Word/Byte Configuration ........................................................ 10
VersatileIO
™ (V
IO) Control ..................................................... 10
Requirements for Reading Array Data ................................... 11
Page Mode Read ............................................................................11
Writing Commands/Command Sequences ............................ 11
Write Buffer .....................................................................................11
Accelerated Program Operation ......................................................11
Autoselect Functions .......................................................................11
Standby Mode ........................................................................ 11
Automatic Sleep Mode ........................................................... 12
RESET#: Hardware Reset Pin ............................................... 12
Output Disable Mode .............................................................. 12
Table 2. Sector Address Table........................................................ 13
Autoselect Mode ..................................................................... 15
Table 3. Autoselect Codes, (High Voltage Method) ....................... 15
Sector Group Protection and Unprotection ............................. 16
Table 4. Sector Group Protection/Unprotection Address Table ..... 16
Write Protect (WP#) ................................................................ 17
Temporary Sector Group Unprotect ....................................... 17
Figure 1. Temporary Sector Group Unprotect Operation ................17
Figure 2. In-System Sector Group Protect/Unprotect Algorithms ...18
SecSi (Secured Silicon) Sector Flash Memory Region .......... 19
Table 5. SecSi Sector Contents ...................................................... 19
Figure 3. SecSi Sector Protect Verify ..............................................20
Hardware Data Protection ...................................................... 20
Low VCC Write Inhibit .....................................................................20
Write Pulse “Glitch” Protection ........................................................20
Logical Inhibit ..................................................................................20
Power-Up Write Inhibit ....................................................................20
Common Flash Memory Interface (CFI) . . . . . . . 20
Table 6. CFI Query Identification String ..........................................21
Table 7. System Interface String..................................................... 21
Table 8. Device Geometry Definition ..............................................22
Table 9. Primary Vendor-Specific Extended Query ........................23
Command Definitions . . . . . . . . . . . . . . . . . . . . . 23
Reading Array Data ................................................................ 23
Reset Command ..................................................................... 24
Autoselect Command Sequence ............................................ 24
Enter SecSi Sector/Exit SecSi Sector Command Sequence .. 24
Word/Byte Program Command Sequence ............................. 24
Unlock Bypass Command Sequence ..............................................25
Write Buffer Programming ...............................................................25
Accelerated Program ......................................................................26
Figure 4. Write Buffer Programming Operation ...............................27
Figure 5. Program Operation ..........................................................28
Program Suspend/Program Resume Command Sequence ... 28
Figure 6. Program Suspend/Program Resume ...............................29
Chip Erase Command Sequence ........................................... 29
Sector Erase Command Sequence ........................................ 29
Erase Suspend/Erase Resume Commands ........................... 30
Figure 7. Erase Operation .............................................................. 30
Command Definitions ............................................................. 31
Table 10. Command Definitions (x16 Mode, BYTE# = V
IH) ........... 31
Table 11. Command Definitions (x8 Mode, BYTE# = V
IL).............. 32
Write Operation Status . . . . . . . . . . . . . . . . . . . . . 33
DQ7: Data# Polling ................................................................. 33
Figure 8. Data# Polling Algorithm .................................................. 33
RY/BY#: Ready/Busy# ............................................................ 34
DQ6: Toggle Bit I .................................................................... 34
Figure 9. Toggle Bit Algorithm ........................................................ 35
DQ2: Toggle Bit II ................................................................... 35
Reading Toggle Bits DQ6/DQ2 ............................................... 35
DQ5: Exceeded Timing Limits ................................................ 36
DQ3: Sector Erase Timer ....................................................... 36
DQ1: Write-to-Buffer Abort ..................................................... 36
Table 12. Write Operation Status................................................... 36
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 37
Figure 10. Maximum Negative Overshoot Waveform ................... 37
Figure 11. Maximum Positive Overshoot Waveform ..................... 37
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 37
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 12. Test Setup .................................................................... 39
Table 13. Test Specifications ......................................................... 39
Key to Switching Waveforms. . . . . . . . . . . . . . . . 39
Figure 13. Input Waveforms and
Measurement Levels ...................................................................... 39
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 40
Read-Only Operations ........................................................... 40
Figure 14. Read Operation Timing ................................................. 40
Figure 15. Page Read Timings ...................................................... 41
Hardware Reset (RESET#) .................................................... 42
Figure 16. Reset Timings ............................................................... 42
Erase and Program Operations .............................................. 43
Figure 17. Program Operation Timings .......................................... 44
Figure 18. Accelerated Program Timing Diagram .......................... 44
Figure 19. Chip/Sector Erase Operation Timings .......................... 45
Figure 20. Data# Polling Timings (During Embedded Algorithms) . 46
Figure 21. Toggle Bit Timings (During Embedded Algorithms) ...... 47
Figure 22. DQ2 vs. DQ6 ................................................................. 47
Temporary Sector Unprotect .................................................. 48
Figure 23. Temporary Sector Group Unprotect Timing Diagram ... 48
Figure 24. Sector Group Protect and Unprotect Timing Diagram .. 49
Alternate CE# Controlled Erase and Program Operations ..... 50
Figure 25. Alternate CE# Controlled Write (Erase/Program)
Operation Timings .......................................................................... 51
Erase And Programming Performance. . . . . . . . 52
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 52
TSOP Pin and BGA Package Capacitance . . . . . 53
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 54
TS056/TSR056—56-Pin Standard and Reverse Pinout Thin
Small Outline Package (TSOP) .............................................. 54
LAA064—64-Ball Fortified Ball Grid Array (FBGA) 13 x 11 mm
Package .................................................................................. 55
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 56


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