전자부품 데이터시트 검색엔진 |
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FP1189 데이터시트(PDF) 11 Page - WJ Communication. Inc. |
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FP1189 데이터시트(HTML) 11 Page - WJ Communication. Inc. |
11 / 12 page Specifications and information are subject to change without notice. WJ Communications, Inc • Phone 1-800- WJ1-4401 • FAX: 408-577-6621 • e- mail: sales@wj.com • Web site: www.wj.com September 2004 FP1189 ½ - Watt HFET Product Information FP1189 (SOT-89 Package) Mechanical Information This package may contain lead-bearing materials. The plating material on the leads is SnPb. Outline Drawing Land Pattern Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85 °C Thermal Resistance, Rth (1) 68 ° C/W Junction Temperature, Tjc (2) 153 ° C 1. The thermal resistance is referenced from the hottest part of the junction to the ground tab (pin 4). 2. This corresponds to the typical drain biasing condition of +8V, 125 mA at an 85 °C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 160 °C. Product Marking The FP1189 will be marked with an “FP1189” designator. An alphanumeric lot code (“XXXX-X”) is also marked below the part designator on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating ESD Rating: Class 1B Value: Passes /500V to <1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 ESD Rating: Class IV Value: Passes at 2000 V min. Test: Charged Device Model (CDM) Standard: JEDEC Standard JESD22-C101 MSL Rating: Level 3 at +235 ° C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper mi nimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. MTTF vs. GND Tab Temperature 0 1 10 100 60 70 80 90 100 110 120 Tab Temperature (°C) |
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