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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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ADP1621 데이터시트(PDF) 5 Page - Analog Devices |
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ADP1621 데이터시트(HTML) 5 Page - Analog Devices |
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5 / 32 page  ADP1621 Rev. A | Page 5 of 32 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating IN to GND −0.3 V to VSHUNT FB, COMP, SDSN, FREQ, GATE to GND −0.3 V to (VIN + 0.3 V) CS to GND −5 V to +33 V PIN to PGND −0.3 V to VSHUNT Supply Current into IN 25 mA Supply Current into PIN 35 mA Storage Temperature Range −55°C to +150°C Junction Operating Temperature Range1 −55°C to +150°C Junction Storage Temperature Range −55°C to +150°C Lead Temperature (Soldering, 10 sec) 300°C Package Power Dissipation1 (TJ,MAX − TA)/θJA 1In applications where high power dissipation and poor package thermal resistance are present, the maximum ambient temperature may need to be derated. Maximum ambient temperature (TA,MAX) is dependent on the maximum operating junction temperature (TJ,MAX = 150oC), the maximum power dissipation of the device in the application (PD,MAX), and the junction- to-ambient thermal resistance of the package in the application (θJA), is given by the following equation: TA,MAX = TJ,MAX --- (θJA x PD,MAX). Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified, all other voltages are referenced to GND. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 3. Thermal Resistance Package Type θJA Unit 10-lead MSOP on a 2-layer PCB 200 °C/W 10-lead MSOP on a 4-layer PCB 172 °C/W Junction-to-ambient thermal resistance of the package is based on modeling and calculation using 2-layer and 4-layer boards, and natural convection. The junction-to-ambient thermal resistance is application- and board-layout dependent. In applications where high maximum power dissipation exists, attention to thermal dissipation issues in board design is required. ESD CAUTION |
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