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AD8189 데이터시트(PDF) 5 Page - Analog Devices |
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AD8189 데이터시트(HTML) 5 Page - Analog Devices |
5 / 24 page AD8188/AD8189 Rev. 0 | Page 5 of 24 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter1 Rating Supply Voltage 5.5 V DVCC to DGND 5.5 V DVCC to VEE 8.0 V VCC to DGND 8.0 V IN0A, IN0B, IN1A, IN1B, IN2A, IN2B, VREF VEE ≤ VIN ≤ VCC SEL A/B, OE DGND ≤ VIN ≤ VCC Output Short-Circuit Operation Indefinite Operating Temperature Range –40°C to +85°C Storage Temperature Range –65°C to +150°C Lead Temperature Range (Soldering, 10 sec) 300°C 1 Specification is for device in free air (TA = 25°C). Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 3. Thermal Resistance Package Type θJA2 θJC Unit 24-Lead TSSOP1 85 20 °C/W 1 Maximum internal power dissipation (PD) should be derated for ambient temperature (TA) such that PD < (150°C TA)/θJA. 2 θJA is on a 4-layer board (2s 2p). MAXIMUM POWER DISSIPATION The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately 150°C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 175°C for an extended period can result in device failure. While the AD8188/AD8189 is internally short circuit protected, this may not be sufficient to guarantee that the maximum junction temperature (150°C) is not exceeded under all conditions. To ensure proper operation, it is necessary to observe the maximum power derating curves shown in Figure 3. 2.5 2.0 1.5 1.0 0.5 0 –50 –40 –30 –20 –10 0 102030405060708090 AMBIENT TEMPERATURE (°C) Figure 3. Maximum Power Dissipation vs. Temperature ESD CAUTION |
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