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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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SST34HF162C-70-4C-LBK 데이터시트(PDF) 9 Page - Silicon Storage Technology, Inc |
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SST34HF162C-70-4C-LBK 데이터시트(HTML) 9 Page - Silicon Storage Technology, Inc |
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9 / 26 page  Preliminary Specifications 16 Mbit Dual-Bank Flash + 2/4 Mbit SRAM ComboMemory SST34HF162C / SST34HF164C 9 ©2004 Silicon Storage Technology, Inc. S71269-01-000 9/04 TABLE 5: SOFTWARE COMMAND SEQUENCE Command Sequence 1st Bus Write Cycle 2nd Bus Write Cycle 3rd Bus Write Cycle 4th Bus Write Cycle 5th Bus Write Cycle 6th Bus Write Cycle Addr1 Data2 Addr1 Data2 Addr1 Data2 Addr1 Data2 Addr1 Data2 Addr1 Data2 Program 555H AAH 2AAH 55H 555H A0H WA3 Data Sector-Erase 555H AAH 2AAH 55H 555H 80H 555H AAH 2AAH 55H SAX4 30H Block-Erase 555H AAH 2AAH 55H 555H 80H 555H AAH 2AAH 55H BAX4 50H Chip-Erase 555H AAH 2AAH 55H 555H 80H 555H AAH 2AAH 55H 555H 10H Erase-Suspend XXXXH B0H Erase-Resume XXXXH 30H Software ID Entry5 555H AAH 2AAH 55H BKX6 555H 90H Software ID Exit 555H AAH 2AAH 55H 555H F0H Software ID Exit XXH F0H T5.0 1269 1. Address format A11-A0 (Hex), Addresses A19-A12 can be VIL or VIH, but no other value, for the command sequence. 2. DQ15-DQ8 can be VIL or VIH, but no other value, for the command sequence 3. WA = Program word address 4. SAX for Sector-Erase; uses A19-A10 address lines BAX for Block-Erase; uses A19-A15 address lines 5. The device does not remain in Software Product Identification mode if powered down. 6. A19 and A18 = VIL Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.) Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -20°C to +85°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +125°C D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD1+0.3V 1. VDD = VDDF and VDDS Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to VDD1+1.0V Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W Output Short Circuit Current2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA 2. Outputs shorted for no more than one second. No more than one output shorted at a time. OPERATING RANGE Range Ambient Temp VDD Commercial 0°C to +70°C 2.7-3.3V Extended -20°C to +85°C 2.7-3.3V AC CONDITIONS OF TEST Input Rise/Fall Time . . . . . . . . . . . . . . 5 ns Output Load . . . . . . . . . . . . . . . . . . . . CL = 30 pF See Figures 16 and 17 |
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