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CS5201-1GST3 데이터시트(PDF) 6 Page - ON Semiconductor

부품명 CS5201-1GST3
상세설명  1.0 A Adjustable Linear Regulator
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제조업체  ONSEMI [ON Semiconductor]
홈페이지  http://www.onsemi.com
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CS5201-1GST3 데이터시트(HTML) 6 Page - ON Semiconductor

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CS5201−1
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Protection Diodes
When large external capacitors are used with a linear
regulator it is sometimes necessary to add protection diodes.
If the input voltage of the regulator gets shorted, the output
capacitor will discharge into the output of the regulator. The
discharge current depends on the value of the capacitor, the
output voltage and the rate at which VIN drops. In the
CS5201−1 linear regulator, the discharge path is through a
large junction and protection diodes are not usually needed.
If the regulator is used with large values of output
capacitance and the input voltage is instantaneously shorted
to ground, damage can occur. In this case, a diode connected
as shown in Figure 13 is recommended.
Figure 13. Protection Diode for Large Output
Capacitors
VIN
CS5201−1
VOUT
Adj
R1
R2
VOUT
VIN
C1
C2
CAdj
IN4002 (Optional)
Output Voltage Sensing
Since the CS5201−1 is a three terminal regulator, it is not
possible to provide true remote load sensing. Load
regulation is limited by the resistance of the conductors
connecting the regulator to the load.
For the adjustable regulator, the best load regulation
occurs when R1 is connected directly to the output pin of the
regulator as shown in Figure 14. If R1 is connected to the
load, RC is multiplied by the divider ratio and the effective
resistance between the regulator and the load becomes.
RC
R1 ) R2
R1
where RC = conductor parasitic resistance.
Figure 14. Grounding Scheme for Adjustable Output
Regulator to Minimize Parasitic Resistance Effects
VIN
VIN
VOUT
Adj
CS5201−1
Conductor Parasitic
Resistance
R1
RLOAD
R2
RC
Calculating Power Dissipation and Heatsink
Requirements
The CS5201−1 linear regulator includes thermal
shutdown and current limit circuitry to protect the device.
High power regulators such as these usually operate at high
junction temperatures so it is important to calculate the
power dissipation and junction temperatures accurately to
ensure that an adequate Heatsink is used.
The case is connected to VOUT on the CS5201−1,
electrical isolation may be required for some applications.
Thermal compound should always be used with high current
regulators such as these.
The thermal characteristics of an IC depend on the
following four factors:
1. Maximum Ambient Temperature TA (°C)
2. Power dissipation PD (Watts)
3. Maximum junction temperature TJ (°C)
4. Thermal resistance junction to ambient RqJA (°C/W)
These four are related by the Equation
TJ + TA ) PD
RqJA
(1)
The maximum ambient temperature and the power
dissipation are determined by the design while the
maximum junction temperature and the thermal resistance
depend on the manufacturer and the package type.
The maximum power dissipation for a regulator is:
PD(max) + {VIN(max) * VOUT(min)}IOUT(max) ) VIN(max)IQ
(2)
where:
VIN(max) is the maximum input voltage,
VOUT(min) is the minimum output voltage,
IOUT(max) is the maximum output current, for the
application
IQ is the maximum quiescent current at IOUT(max).
A Heatsink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment has a thermal resistance. Like series
electrical resistances, these resistances are summed to
determine RqJA, the total thermal resistance between the
junction and the surrounding air.
1. Thermal Resistance of the junction−to−case, RqJC
(°C/W)
2. Thermal Resistance of the case to Heatsink, RqCS
(°C/W)
3. Thermal Resistance of the Heatsink to the ambient
air, RqSA (°C/W)
These are connected by the Equation:
RqJA + RqJC ) RqCS ) RqSA
(3)


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