MC74VHCT157A

http://onsemi.com

3

Symbol

Parameter

Value

Unit

Positive DC Supply Voltage

−0.5 to +7.0

V

Digital Input Voltage

−0.5 to +7.0

V

DC Output Voltage

Output in 3−State

High or Low State

−0.5 to +7.0

V

Input Diode Current

−20

mA

Output Diode Current

$20

mA

DC Output Current, per Pin

$25

mA

$75

mA

Power Dissipation in Still Air

SOIC Package

TSSOP

200

180

mW

Storage Temperature Range

−65 to +150

°C

ESD Withstand Voltage

Human Body Model (Note 2)

Machine Model (Note 3)

Charged Device Model (Note 4)

>2000

>200

>2000

V

Latchup Performance

$300

mA

Thermal Resistance, Junction−to−Ambient

SOIC Package

TSSOP

143

164

°C/W

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit

values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,

damage may occur and reliability may be affected.

1. Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the

Recommended Operating Conditions.

2. Tested to EIA/JESD22−A114−A

3. Tested to EIA/JESD22−A115−A

4. Tested to JESD22−C101−A

5. Tested to EIA/JESD78

RECOMMENDED OPERATING CONDITIONS

Symbol

Characteristics

Min

Max

Unit

DC Supply Voltage

4.5

5.5

V

DC Input Voltage

0

5.5

V

DC Output Voltage

Output in 3−State

High or Low State

0

V

Operating Temperature Range, all Package Types

−55

125

°C

Input Rise or Fall Time

0

20

ns/V

DEVICE JUNCTION TEMPERATURE VERSUS TIME TO

0.1% BOND FAILURES

Junction

Temperature

°C

Time, Hours

Time, Years

80

1,032,200

117.8

90

419,300

47.9

100

178,700

20.4

110

79,600

9.4

120

37,000

4.2

130

17,800

2.0

140

8,900

1.0

1

1

10

100

1000

TIME, YEARS

FAILURE RATE OF PLASTIC = CERAMIC

UNTIL INTERMETALLICS OCCUR

Figure 4. Failure Rate vs. Time Junction Temperature