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FDFS6N548 데이터시트(PDF) 3 Page - Fairchild Semiconductor |
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FDFS6N548 데이터시트(HTML) 3 Page - Fairchild Semiconductor |
3 / 7 page FDFS6N548 Rev.B www.fairchildsemi.com 3 Notes: 1: RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user’s board design. 2: Pulse Test: Pulse Width < 300 µs, Duty cycle < 2.0%. 3: Starting TJ = 25°C, L = 1mH, IAS = 5.0A, VDD = 27V, VGS = 10V. c) 135°C/W when mounted on a minimun pad a) 78°C/W when mounted on a 0.5in2 pad of 2 oz copper b) 125°C/W when mounted on a 0.02 in2 pad of 2 oz copper |
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