 |
전자부품 데이터시트 검색엔진 |
|
|
전자부품 데이터시트 검색엔진 |
|
AD8175 데이터시트(PDF) 7 Page - Analog Devices |
|
||||||||||||||||||||||||||||||
AD8175 데이터시트(HTML) 7 Page - Analog Devices |
|
|
7 / 40 page  AD8175 Rev. 0 | Page 7 of 40 ABSOLUTE MAXIMUM RATINGS Table 12. Parameter Rating Analog Supply Voltage (VPOS – VNEG) +6 V Digital Supply Voltage (VDD – DGND) +6 V Ground Potential Difference (VNEG – DGND) +0.5 V to −2.5 V Maximum Potential Difference (VDD – VNEG) +8 V Common-Mode Analog Input Voltage (VNEG – 0.5 V) to (VPOS + 0.5 V) Differential Analog Input Voltage ±2 V Digital Input Voltage VDD Output Voltage (Disabled Analog Output) (VPOS – 1 V) to (VNEG + 1 V) Output Short-Circuit Duration Momentary Storage Temperature −65°C to +125°C Operating Temperature Range −40°C to +85°C Lead Temperature (Soldering 10 sec) 300°C Junction Temperature 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 13. Thermal Resistance Package Type θJA Unit PBGA 15 °C/W POWER DISSIPATION The AD8175 is operated with ±2.5 V or +5 V supplies and can drive loads down to 100 Ω, resulting in a large range of possible power dissipations. For this reason, extra care must be taken derating the operating conditions based on ambient temperature. Packaged in a 676-lead BGA, the AD8175 junction-to-ambient thermal impedance (θJA) is 15°C/W. For long-term reliability, the maximum allowed junction temperature of the die should not exceed 150°C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in stresses exerted on the die by the package. Exceeding a junction temperature of 175°C for an extended period can result in device failure. The following curve shows the range of allowed internal die power dissipations that meet these conditions over the −40°C to +85°C ambient temperature range. When using Table 12, do not include external load power in the Maximum Power calculation, but do include load current dropped on the die output transistors. AMBIENT TEMPERATURE (°C) 3 4 5 6 7 8 9 10 15 25 35 45 55 65 75 85 TJ = 150°C Figure 4. Maximum Die Power Dissipation vs. Ambient Temperature ESD CAUTION |
유사한 부품 번호 - AD8175 |
|
유사한 설명 - AD8175 |
|
|
링크 URL |
| 개인정보취급방침 |
| ALLDATASHEET.CO.KR |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Korean ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
