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AM29LV640D_07 데이터시트(Datasheet) 5 Page - Advanced Micro Devices

부품명 AM29LV640D_07
상세내용  64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only Uniform Sector Flash Memory with VersatileIO™ Control
PDF  57 Pages
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제조사  AMD [Advanced Micro Devices]
홈페이지  http://www.amd.com
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January 22, 2007 22366C6
Am29LV640D/Am29LV641D
3
D A TA
SH EE T
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5
Special Handling Instructions for FBGA/fBGA Packages ......... 7
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10
Table 1. Device Bus Operations .....................................................10
VersatileIO
™ (V
IO) Control ..................................................... 10
Requirements for Reading Array Data ................................... 10
Writing Commands/Command Sequences ............................ 11
Accelerated Program Operation ......................................................11
Autoselect Functions .......................................................................11
Standby Mode ........................................................................ 11
Automatic Sleep Mode ........................................................... 11
RESET#: Hardware Reset Pin ............................................... 11
Output Disable Mode .............................................................. 12
Table 2. Sector Address Table ........................................................12
Autoselect Mode ..................................................................... 16
Table 3. Autoselect Codes, (High Voltage Method) .......................16
Sector Group Protection and Unprotection ............................. 17
Table 4. Sector Group Protection/Unprotection Address Table .....17
Write Protect (WP#) ................................................................ 18
Temporary Sector Group Unprotect ....................................... 18
Figure 1. Temporary Sector Group Unprotect Operation................ 18
Figure 2. In-System Sector Group Protect/Unprotect Algorithms ... 19
SecSi (Secured Silicon) Sector Flash Memory Region .......... 20
Table 5. SecSi Sector Contents ......................................................20
Hardware Data Protection ...................................................... 20
Low VCC Write Inhibit .....................................................................20
Write Pulse “Glitch” Protection ........................................................21
Logical Inhibit ..................................................................................21
Power-Up Write Inhibit ....................................................................21
Common Flash Memory Interface (CFI) . . . . . . . 21
Table 6. CFI Query Identification String .......................................... 21
System Interface String................................................................... 22
Table 8. Device Geometry Definition .............................................. 22
Table 9. Primary Vendor-Specific Extended Query ........................ 23
Command Definitions . . . . . . . . . . . . . . . . . . . . . 23
Reading Array Data ................................................................ 23
Reset Command ..................................................................... 24
Autoselect Command Sequence ............................................ 24
Enter SecSi Sector/Exit SecSi Sector Command Sequence .. 24
Word Program Command Sequence ..................................... 24
Unlock Bypass Command Sequence ..............................................25
Figure 3. Program Operation .......................................................... 25
Chip Erase Command Sequence ........................................... 25
Sector Erase Command Sequence ........................................ 26
Erase Suspend/Erase Resume Commands ........................... 26
Figure 4. Erase Operation............................................................... 27
Command Definitions ............................................................. 28
Command Definitions...................................................................... 28
Write Operation Status . . . . . . . . . . . . . . . . . . . . . 29
DQ7: Data# Polling ................................................................. 29
Figure 5. Data# Polling Algorithm ................................................... 29
RY/BY#: Ready/Busy# ............................................................ 30
DQ6: Toggle Bit I .................................................................... 30
Figure 6. Toggle Bit Algorithm........................................................ 30
DQ2: Toggle Bit II ................................................................... 31
Reading Toggle Bits DQ6/DQ2 ............................................... 31
DQ5: Exceeded Timing Limits ................................................ 31
DQ3: Sector Erase Timer ....................................................... 31
Table 11. Write Operation Status ................................................... 32
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 33
Figure 7. Maximum Negative Overshoot Waveform ..................... 33
Figure 8. Maximum Positive Overshoot Waveform....................... 33
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 33
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 9. I
CC1 Current vs. Time (Showing
Active and Automatic Sleep Currents) ........................................... 35
Figure 10. Typical I
CC1 vs. Frequency ............................................ 35
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 11. Test Setup.................................................................... 36
Table 12. Test Specifications ......................................................... 36
Key to Switching Waveforms. . . . . . . . . . . . . . . . 36
Figure 12. Input Waveforms and
Measurement Levels...................................................................... 36
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 37
Read-Only Operations ........................................................... 37
Figure 13. Read Operation Timings ............................................... 37
Hardware Reset (RESET#) .................................................... 38
Figure 14. Reset Timings ............................................................... 38
Erase and Program Operations .............................................. 39
Figure 15. Program Operation Timings.......................................... 40
Figure 16. Accelerated Program Timing Diagram.......................... 40
Figure 17. Chip/Sector Erase Operation Timings .......................... 41
Figure 18. Data# Polling Timings
(During Embedded Algorithms)...................................................... 42
Figure 19. Toggle Bit Timings
(During Embedded Algorithms)...................................................... 43
Figure 20. DQ2 vs. DQ6................................................................. 43
Temporary Sector Unprotect .................................................. 44
Figure 21. Temporary Sector Group Unprotect Timing Diagram ... 44
Figure 22. Sector Group Protect and Unprotect Timing Diagram .. 45
Alternate CE# Controlled Erase and Program Operations ..... 46
Figure 23. Alternate CE# Controlled Write
(Erase/Program) Operation Timings .............................................. 47
Erase And Programming Performance . . . . . . . 48
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 48
TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . . 48
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 49
SSO056—56-Pin Shrink Small Outline Package (SSOP) ...... 49
FBE063—63-Ball Fine-Pitch Ball Grid Array
(FBGA) 12 x 11 mm package ................................................. 50
LAA064—64-Ball Fortified Ball Grid Array
(FBGA) 13 x 11 mm package ................................................. 51
TS 048—48-Pin Standard TSOP ............................................ 52
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 53




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