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MPXV7007G 데이터시트(Datasheet) 5 Page - Freescale Semiconductor, Inc

부품명 MPXV7007G
상세내용  Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
PDF  12 Pages
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제조사  FREESCALE [Freescale Semiconductor, Inc]
홈페이지  http://www.freescale.com
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 5 page
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MPXV7007G
Sensors
Freescale Semiconductor
5
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The MPX pressure
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must
be the correct size to ensure proper solder connection
interface between the board and the package. With the
correct footprint, the packages will self align when subjected
to a solder reflow process. It is always recommended to
design boards with a solder mask layer to avoid bridging and
shorting between solder pads.
Figure 5. Small Outline Package Footprint
Part Number
Case Type
Pressure (P1)
Side Identifier
MPXV7007GC6U/C6T1
482A
Side with Port Attached
MPXV7007GP
1369
Side with Port Attached
MPXV7007DP
1351
Side with Part Marking
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
inch
mm
SCALE 2:1




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