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HLMP-AM86 데이터시트(PDF) 9 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-AM86 데이터시트(HTML) 9 Page - AVAGO TECHNOLOGIES LIMITED |
9 / 12 page 9 Precautions: Lead Forming: • TheleadsofanLEDlampmaybepreformedorcutto lengthpriortoinsertionandsolderingonPCboard. • Forbettercontrol,itisrecommendedtousepropertool topreciselyformandcuttheleadstoapplicablelength ratherthandoingitmanually. • Ifmanualleadcuttingisnecessary,cuttheleadsafter thesolderingprocess.Thesolderconnectionformsa mechanicalgroundwhichpreventsmechanicalstress duetoleadcuttingfromtravelingintoLEDpackage. Thisishighlyrecommendedforhandsolderoperation, astheexcessleadlengthalsoactsassmallheatsink. Soldering and Handling: • CaremustbetakenduringPC�assemblyandsoldering processtopreventdamagetotheLEDcomponent. • LEDcomponentmaybeeffectivelyhandsolderedto PC�.However,itisonlyrecommendedunderunavoid- ablecircumstancessuchasrework.Theclosestmanual soldering distance of the soldering heat source (sol- deringiron’stip)tothebodyis1.�9mm.Solderingthe LEDusingsolderingirontipcloserthan1.�9mmmight damagetheLED. ��ote: 1. PC� with different size and design (component density) will have differentheatmass(heatcapacity).Thismightcauseachangeintem- peratureexperiencedbytheboardifsamewavesolderingsettingis used.So,itisrecommendedtore-calibratethesolderingprofileagain beforeloadinganewtypeofPC�. �. AvagoTechnologies’highbrightnessLEDareusinghighefficiency LEDdiewithsinglewirebondasshownbelow.Customerisadvised to take extra precaution during wave soldering to ensure that the maximumwavetemperaturedoesnotexceed��0°Candthesolder contacttimedoesnotexceeding3sec.Over-stressingtheLEDduring solderingprocessmightcauseprematurefailuretotheLEDdueto delamination. Avago Technologies LED configuration 1.�9mm • ESDprecautionmustbeproperlyappliedonthesolder- ingstationandpersonneltopreventESDdamagetothe LEDcomponentthatisESDsensitive.DorefertoAvago applicationnoteA��11��fordetails.Thesolderingiron usedshouldhavegroundedtiptoensureelectrostatic chargeisproperlygrounded. • Recommendedsolderingcondition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperat�re 105 °C Max. - Preheat time 60 sec Max - Peak temperat�re 250 °C Max. 260 °C Max. �well time 3 sec Max. 5 sec Max ��ote: 1) Aboveconditionsreferstomeasurementwiththermocouplemounted atthebottomofPC�. �) Itisrecommendedtouseonlybottompreheatersinordertoreduce thermalstressexperiencedbyLED. • Wavesolderingparametersmustbesetandmaintained accordingtotherecommendedtemperatureanddwell time.Customerisadvisedtoperformdailycheckonthe solderingprofiletoensurethatitisalwaysconforming torecommendedsolderingconditions. ��ote:ElectricalconnectionbetweenbottomsurfaceofLEDdieand theleadframeisachievedthroughconductivepaste. • Anyalignmentfixturethatisbeingappliedduringwave solderingshouldbelooselyfittedandshouldnotapply weightorforceonLED.��onmetalmaterialisrecom- mendedasitwillabsorblessheatduringwavesolder- ingprocess. • At elevated temperature, LED is more susceptible to mechanicalstress.Therefore,PC�mustallowedtocool down to room temperature prior to handling, which includesremovalofalignmentfixtureorpallet. • IfPC�boardcontainsboththroughhole(TH)LEDand othersurfacemountcomponents,itisrecommended thatsurfacemountcomponentsbesolderedonthetop sideofthePC�.Ifsurfacemountneedtobeonthebot- tomside,thesecomponentsshouldbesolderedusing reflowsolderingpriortoinsertiontheTHLED. • Recommended PC board plated through holes (PTH) sizeforLEDcomponentleads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) • Over-sizingthePTHcanleadtotwistedLEDafterclinch- ing.OntheotherhandundersizingthePTHcancause difficultyinsertingtheTHLED. CATHODE ANODE AlInGaP Device InGaN Device |
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