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TA7368FG 데이터시트(PDF) 8 Page - Toshiba Semiconductor |
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TA7368FG 데이터시트(HTML) 8 Page - Toshiba Semiconductor |
8 / 12 page TA7368PG/FG 2006-04-28 8 ※ F+PCB By being mounted on certain PCB's, flat packages increase the heat dissipating efficiency. Data shown on the left is resulted from the measurement on the PCB recommended by TOSHIBA. (θj−Τ : Thermal resistance) Printed Circuit Board Material: Phenol resin Thickness of copper leaf: 35µm Plate thickness: 1.6mm ※ F + PCB θj − T = 210°C / W 1.2 1.0 0.8 0.6 0.4 0.2 0 20 40 60 80 100 120 160 0 140 PD – Ta Ambient Temperature Ta (°C) TA7368PG ※ F + PCB TA7368FG |
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