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SN74AUP1G57DCKRE4 데이터시트(PDF) 1 Page - Texas Instruments |
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SN74AUP1G57DCKRE4 데이터시트(HTML) 1 Page - Texas Instruments |
1 / 18 page www.ti.com FEATURES DRY PACKAGE (TOP VIEW) V CC 6 5 4 2 3 Y 1 PR EV IE W In1 In1 In1 In1 In2 In2 In2 In2 GND GND GND GND In0 In0 In0 In0 YZP PACKAGE (BOTTOMVIEW) In0 In2 GND In1 YFP PACKAGE (BOTTOMVIEW) PR EV IE W In0 In2 GND In1 DESCRIPTION/ORDERING INFORMATION SN74AUP1G57 LOW-POWER CONFIGURABLE MULTIPLE-FUNCTION GATE SCES503G – NOVEMBER 2003 – REVISED APRIL 2007 • Available in the Texas Instruments • 3.6-V I/O Tolerant to Support Mixed-Mode NanoFree™ Packages Signal Operation • Low Static-Power Consumption • t pd = 5.3 ns Max at 3.3 V (I CC = 0.9 µA Max) • Suitable for Point-to-Point Applications • Low Dynamic-Power Consumption • Latch-Up Performance Exceeds 100 mA Per (C pd = 4.3 pF Typ at 3.3 V) JESD 78, Class II • Low Input Capacitance (C i = 1.5 pF Typ) • ESD Performance Tested Per JESD 22 • Low Noise – Overshoot and Undershoot – 2000-V Human-Body Model <10% of V CC (A114-B, Class II) • I off Supports Partial-Power-Down Mode – 200-V Machine Model (A115-A) Operation – 1000-V Charged-Device Model (C101) • Includes Schmitt-Trigger Inputs • ESD Protection Exceeds ±5000 V With • Wide Operating V CC Range of 0.8 V to 3.6 V Human-Body Model • Optimized for 3.3-V Operation The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity, which produces very low undershoot and overshoot characteristics. The SN74AUP1G57 features configurable multiple functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XNOR, inverter, and noninverter. All inputs can be connected to VCC or GND. The device functions as an independent gate with Schmitt-trigger inputs, which allow for slow input transition and better switching noise immunity at the input. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. UNLESS OTHERWISE NOTED this document contains Copyright © 2003–2007, Texas Instruments Incorporated PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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