www.ti.com

DEVICE INFORMATION

1

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

LVCC−

LOUT

LVCC+

LIN+

LIN−

NC

NC

NC

NC

NC

RVCC−

ROUT

RVCC+

RIN+

RIN−

NC

NC

NC

NC

NC

NC − No internal connection

TPA6120A2

SLOS431 – MARCH 2004

Thermally Enhansed SOIC (DWP)

PowerPAD™ Package

Top View

TERMINAL FUNCTIONS

PIN NAME

PIN NUMBER

I/O

DESCRIPTION

Left channel negative power supply – must be kept at the same potential as

LVCC-

1

I

RVCC-.

LOUT

2

O

Left channel output

LVCC+

3

I

Left channel positive power supply

LIN+

4

I

Left channel positive input

LIN-

5

I

Left channel negative input

NC

6,7,8,9,10,11,12,13,14,15

-

Not internally connected

RIN-

16

I

Right channel negative input

RIN+

17

I

Right channel positive input

RVCC+

18

I

Right channel positive power supply

ROUT

19

O

Right channel output

Right channel negative power supply - must be kept at the same potential as

RVCC-

20

I

LVCC-.

Connect to ground. The thermal pad must be soldered down in all

Thermal Pad

-

-

applications to properly secure device on the PCB.

5