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CS495313-CVZ 데이터시트(PDF) 11 Page - Cirrus Logic |
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CS495313-CVZ 데이터시트(HTML) 11 Page - Cirrus Logic |
11 / 38 page CS4953xx Data Sheet 32-bit Audio Decoder DSP Family DS705PP2 ®Copyright 2008 Cirrus Logic, Inc. 11 5.4 Power Supply Characteristics (measurements performed under operating conditions) 5.5 Thermal Data (144 LQFP) 5.6 Thermal Data (128 LQFP) Notes: 1. Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz copper covering 20 % of the top & bottom layers. 2. Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz copper covering 20 % of the top & bottom layers and 0.5-oz copper covering 90 % of the internal power plane and ground plane layers. 3. To calculate the die temperature for a given power dissipation 4. Τ j = Ambient Temperature + [ (Power Dissipation in Watts) * θ ja ] 5. To calculate the case temperature for a given power dissipation 6. Τ c = Τ j - [ (Power Dissipation in Watts) * ψ jt ] 5.7 Switching Characteristics— RESET Parameter Min Typ Max Unit Power supply current: Core and I/O operating: VDD1 PLL operating: VDDA With external memory and most ports operating: VDDIO 1. Dependent on application firmware and DSP clock speed. - - - 500 3.5 120 - - - mA mA mA Parameter Symbol Min Typ Max Unit Thermal Resistance (Junction to Ambient) Two-layer Board1 Four-layer Board2 θ ja - - 48 40 - - °C / Watt Thermal Resistance (Junction to Top of Package) Two-layer Board1 Four-layer Board2 ψ jt - - .39 .33 - - °C / Watt Parameter Symbol Min Typ Max Unit Thermal Resistance (Junction to Ambient) Two-layer Board1 Four-layer Board2 θ ja - - 53 44 - - °C / Watt Thermal Resistance (Junction to Top of Package) Two-layer Board1 Four-layer Board2 ψ jt - - .45 .39 - - °C / Watt Parameter Symbol Min Max Unit RESET# minimum pulse width low Trstl 1- μs All bidirectional pins high-Z after RESET# low Trst2z -100 ns Configuration pins setup before RESET# high Trstsu 50 - ns Configuration pins hold after RESET# high Trsthld 20 - ns |
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