전자부품 데이터시트 검색엔진 |
|
ULN2077B 데이터시트(PDF) 5 Page - STMicroelectronics |
|
ULN2077B 데이터시트(HTML) 5 Page - STMicroelectronics |
5 / 7 page MOUNTING INSTRUCTIONS The Rth j-amb can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board (Fig. 12) or to an external heatsink (Fig. 13). The diagram of figure 14 shows the maximum dis- sipable power Ptot and the Rth j-amb as a function of the side " ∝" of two equal square copper areas hav- ing a thickness of 35 µ (1.4 mils). During soldering the pins temperature must not ex- ceed 260 °C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 12 : Example of P.C. Board Area which is Used as Heatsink. Figure 13 : External Heatsink Mounting Example. Figure 14 : Maximum Dissipable Power and Junc- tion to Ambient Thermal Resistance vs. Side "I". Figure 15 : Maximum Allowable Power Dissipa- tion vs. Ambient Temperature. ULN2065B-ULN2067B-ULN2069B-ULN2071B-ULN2075B-ULN2077B 5/7 |
유사한 부품 번호 - ULN2077B |
|
유사한 설명 - ULN2077B |
|
|
링크 URL |
개인정보취급방침 |
ALLDATASHEET.CO.KR |
ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |