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TS4990IJT 데이터시트(PDF) 3 Page - STMicroelectronics |
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3 / 32 page TS4990 Absolute maximum ratings and operating conditions 3/32 1 Absolute maximum ratings and operating conditions Table 1. Absolute maximum ratings (AMR) Symbol Parameter Value Unit VCC Supply voltage (1) 6V Vin Input voltage (2) GND to VCC V Toper Operating free-air temperature range -40 to + 85 °C Tstg Storage temperature -65 to +150 °C Tj Maximum junction temperature 150 °C Rthja Thermal resistance junction to ambient Flip chip (3) MiniSO-8 DFN8 250 215 120 °C/W Pdiss Power dissipation Internally limited ESD HBM: Human body model(4) MM: Machine model(5) 2 200 kV V Latch-up immunity 200 mA Lead temperature (soldering, 10sec) Lead temperature (soldering, 10sec) for lead-free version 250 260 °C 1. All voltage values are measured with respect to the ground pin. 2. The magnitude of the input signal must never exceed VCC + 0.3 V / GND - 0.3 V. 3. The device is protected in case of over temperature by a thermal shutdown active at 150° C. 4. Human body model: A 100 pF capacitor is charged to the specified voltage, then discharged through a 1.5 k Ω resistor between two pins of the device. This is done for all couples of connected pin combinations while the other pins are floating. 5. Machine model: A 200 pF capacitor is charged to the specified voltage, then discharged directly between two pins of the device with no external series resistor (internal resistor < 5 Ω). This is done for all couples of connected pin combinations while the other pins are floating. Table 2. Operating conditions Symbol Parameter Value Unit VCC Supply voltage 2.2 to 5.5 V Vicm Common mode input voltage range 1.2V to VCC V VSTBY Standby voltage input: Device ON Device OFF 1.35 ≤ VSTBY ≤ VCC GND ≤ VSTBY ≤ 0.4 V RL Load resistor ≥ 4 Ω TSD Thermal shutdown temperature 150 °C Rthja Thermal resistance junction to ambient Flip-chip (1) MiniSO-8 DFN8(2) 100 190 40 °C/W 1. This thermal resistance is reached with a 100 mm2 copper heatsink surface. 2. When mounted on a 4-layer PCB. |
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