FAN5336 Rev. 1.0.1

9

© 2004 Fairchild Semiconductor Corporation

www.fairchildsemi.com

Mechanical Dimensions

Dimensions are in millimeters unless otherwise noted.

Figure 12. 6-Lead 3x3 Ultrathin Molded Leadless Package (UMLP)

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES PER

A. CONFORMS TO JEDEC REGISTRATION MO-229,

VARIATION VEEA, DATED 8/2003, EXCEPT THICKNESS

ASME Y14.5M, 1994

0.10

CA B

0.05

C

0.15 C

0.08 C

B

A

C

3.0

3.0

0.05

0.00

2.00

1.21

1.90

0.15 C

2X

2X

0.45

0.20

0.6 MAX

SEATING

PLANE

2.10

1.65

2.45

0.65 TYP

0.95 TYP

3.50

0.10 C

PIN #1 IDENT

1

3

4

6

13

4

6

(0.70)

0.30~0.45

0.2 MIN

(0.20)

0.95

D. FILENAME AND REVISION: UMLP06Arev1