전자부품 데이터시트 검색엔진 |
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AD5821A-WAFER 데이터시트(PDF) 5 Page - Analog Devices |
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AD5821A-WAFER 데이터시트(HTML) 5 Page - Analog Devices |
5 / 16 page AD5821A Rev. 0 | Page 5 of 16 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 4. Parameter Rating VDD to AGND −0.3 V to +5.5 V VDD to DGND −0.3 V to VDD + 0.3 V AGND to DGND −0.3 V to +0.3 V SCL, SDA to DGND −0.3 V to VDD + 0.3 V XSHUTDOWN to DGND −0.3 V to VDD + 0.3 V ISINK to AGND −0.3 V to VDD + 0.3 V Operating Temperature Range Industrial (B Version) −30°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature (TJ MAX) 150°C WLCSP Power Dissipation (TJ MAX − TA)/θJA θJA Thermal Impedance1 Mounted on 4-Layer Board 95°C/W Lead Temperature, Soldering Maximum Peak Reflow Temperature2 260°C (±5°C) 1 To achieve the optimum θJA, it is recommended that the AD5821A be soldered on a 4-layer board. 2 As per JEDEC J-STD-020C. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION |
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