SSC

UR201

Revision : 1.0

Revision : 1.0

www.ZLED.com

www.ZLED.com

서식번호 : SSC-QP-7-07-24 (Rev.0.0)

4. Soldering profile

Reflow Soldering Conditions/ Profile

(1) Lead Solder

Temperature

rise: 5°C/sec.

-5°C/sec.

Cooling:

Pre-heating

Operation heating

60 to 120 sec.

5sec. max

120

150

240

°C

0

(2) Lead-Free Solder

• Preliminary heating to be at 150℃max. for 2 minutes max.

• Soldering heat to be at 240℃max. for 5 seconds max.

• Preliminary heating to be at 150℃max. for 2 minutes max.

• Soldering heat to be at 255℃(+5/-0)℃max. for 10 seconds max.

120

60 to 120 sec.

0

(+5)

255

150

°C

Pre-heating

rise: 5°C/sec.

Temperature

5 to 10 sec.

Operation heating

-5°C/sec.

Cooling:

(3) Hand Soldering Condition

• Not more than 3 seconds @MAX280℃, under Soldering iron.

[Note] In case the soldered products are reused in soldering process, we don’t guarantee the products.