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TC1054-2.7VCT 데이터시트(PDF) 11 Page - TelCom Semiconductor, Inc

부품명 TC1054-2.7VCT
상세설명  50mA CMOS LDO WITH SHUTDOWN AND ERROR OUTPUT
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TC1055
5
PRELIMINARY INFORMATION
TC1055-01 6/5/97
100mA CMOS LDO WITH SHUTDOWN
AND ERROR OUTPUT
In this example, the TC1055 dissipates a maximum of
only 60mW; far below the allowable limit of 318mW. In a
similar manner, Equation 1 and Equation 2 can be used to
calculate maximum current and/or input voltage limits. For
example, the maximum allowable VIN is found by substitut-
ing the maximum allowable power dissipation of 318mW
into Equation 1, from which VINMAX = 5.9V.
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower
θJA and therefore in-
crease the maximum allowable power dissipation limit.
PD ≈ (VINMAX – VOUTMIN)ILOADMAX
Where:
PD = Worst case actual power dissipation
VIN
MAX = Maximum voltage on VIN
VOUT
MIN = Minimum regulator output voltage
ILOAD
MAX = Maximum output (load) current
Equation 1.
The maximum
allowable power dissipation (Equation 2)
is a function of the maximum ambient temperature (TAMAX),
the maximum allowable die temperature (125
°C) and the
thermal resistance from junction-to-air (
θJA). SOT-23A-5
package has a
θJA of approximately 220°C/Watt when
mounted on a single layer FR4 dielectric copper clad PC
board.
PD
MAX = (TJMAX – TJMAX)
θJA
Where all terms are previously defined.
Equation 2.
Equation 1 can be used in conjunction with Equation 2
to ensure regulator thermal operation is within limits. For
example:
Given:
VIN
MAX = 3.0V ±5%
VOUT
MIN = 2.7V ±0.5V
ILOAD = 40mA
TAMAX = 55°C
Find:
1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD ≈ (VINMAX – VOUTMIN)ILOADMAX
= [(3.0 x 1.05) – (2.7 x .995)]40 x 10–3
= 18.5mW
Maximum allowable power dissipation:
PDMAX = (TJ
MAX – TAMAX)
θJA
= (125 – 55)
220
= 318mW


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