전자부품 데이터시트 검색엔진 |
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TC1427COA 데이터시트(PDF) 2 Page - TelCom Semiconductor, Inc |
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TC1427COA 데이터시트(HTML) 2 Page - TelCom Semiconductor, Inc |
2 / 6 page 4-208 TELCOM SEMICONDUCTOR, INC. 1.2A DUAL HIGH-SPEED MOSFET DRIVERS TC1426 TC1427 TC1428 ELECTRICAL CHARACTERISTICS: TA = 25 °C with 4.5V ≤ VDD+ ≤ 16V unless otherwise specified. Symbol Parameter Test Conditions Min Typ Max Unit Input VIH Logic 1, Input Voltage 3 — — V VIL Logic 0, Input Voltage — — 0.8 V IIN Input Current 0V ≤ VIN ≤ VDD – 1 — 1 µA Output VOH High Output Voltage Test Figures 1 and 2 VDD – 0.025 — — V VOL Low Output Voltage Test Figures 1 and 2 — — 0.025 V RO Output Resistance VIN = 0.8V, — 12 18 Ω IOUT = 10 mA, VDD = 16V VIN = 3V, — 8 12 IOUT = 10 mA, VDD = 16V IPK Peak Output Current — 1.2 — A I Latch-Up Current Withstand Reverse Current > 500 — — mA Switching Time (Note 1) tR Rise Time Test Figures 1 and 2 — — 35 nsec tF Fall Time Test Figures 1 and 2 — — 25 nsec tD1 Delay Time Test Figures 1 and 2 — — 75 nsec tD2 Delay Time Test Figures 1 and 2 — — 75 nsec Power Supply IS Power Supply Current VIN = 3V (Both Inputs) — — 9 mA VIN = 0V (Both Inputs) — — 0.5 Note: 1. Switching times guaranteed by design. ABSOLUTE MAXIMUM RATINGS* Power Dissipation (TA ≤ 70°C) Plastic DIP ........................................................... 730W SOIC ................................................................ 470 mW Derating Factor Plastic DIP ..................................................... 8 mW/ °C SOIC .............................................................. 4 mW/ °C Supply Voltage ............................................................ 18V Input Voltage, Any Terminal .. (V DD + 0.3V) to (GND – 0.3V) Operating Temperature : C Version .............. 0 °C to +70°C E Version ......... – 40 °C to +85°C *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum Chip Temperature ................................. +150 °C Storage Temperature ............................. +65 °C to +150°C Lead Temperature (Soldering ,10 sec) ................. +300 °C |
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