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A3P030-FVQG144PP 데이터시트(Datasheet) 19 Page - Actel Corporation

부품명 A3P030-FVQG144PP
상세내용  ProASIC3 Flash Family FPGAs
PDF  206 Pages
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제조사  ACTEL [Actel Corporation]
홈페이지  http://www.actel.com
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 19 page
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ProASIC3 DC and Switching Characteristics
v1.3
2 - 5
Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not
the ambient temperature. This is an important distinction because dynamic and static power
consumption cause the chip junction to be higher than the ambient temperature.
EQ 2-1 can be used to calculate junction temperature.
TJ = Junction Temperature = ∆T + TA
EQ 2-1
where:
TA = Ambient Temperature
∆T = Temperature gradient between junction (silicon) and ambient ∆T = θja * P
θja = Junction-to-ambient of the package. θja numbers are located in Table 2-5.
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is
θjc and the junction-to-ambient air thermal
resistivity is
θja. The thermal characteristics for θja are shown for two air flow rates. The absolute
maximum junction temperature is 100°C. EQ 2-2 shows a sample calculation of the absolute
maximum power dissipation allowed for a 484-pin FBGA package at commercial temperature and
in still air.
EQ 2-2
Maximum Power Allowed
Max. junction temp. (
° C) Max. ambient temp. (° C)
θ
ja(° C/W)
-----------------------------------------------------------------------------------------------------------------------------------------
100
° C70° C
20.5
° C/W
--------------------------------------
1.463 W
·
=
=
=
Table 2-5 •
Package Thermal Resistivities
Package Type
Device
Pin Count
θjc
θja
Units
Still Air 200 ft./min. 500 ft./min.
Quad Flat No Lead
A3P030
132
0.4
21.4
16.8
15.3
C/W
A3P060
132
0.3
21.2
16.6
15.0
C/W
A3P125
132
0.2
21.1
16.5
14.9
C/W
A3P250
132
0.1
21.0
16.4
14.8
C/W
Very Thin Quad Flat Pack (VQFP)
All devices
100
10.0
35.3
29.4
27.1
C/W
Thin Quad Flat Pack (TQFP)
All devices
144
11.0
33.5
28.0
25.7
C/W
Plastic Quad Flat Pack (PQFP)
All devices
208
8.0
26.1
22.5
20.8
C/W
PQFP with embedded heatspreader
All devices
208
3.8
16.2
13.3
11.9
C/W
Fine Pitch Ball Grid Array (FBGA)
See note*
144
3.8
26.9
22.9
21.5
C/W
See note*
256
3.8
26.6
22.8
21.5
C/W
See note*
484
3.2
20.5
17.0
15.9
C/W
A3P1000
144
6.3
31.6
26.2
24.2
C/W
A3P1000
256
6.6
28.1
24.4
22.7
C/W
A3P1000
484
8.0
23.3
19.0
16.7
C/W
* This information applies to all ProASIC3 devices except the A3P1000. Detailed device/package thermal
information will be available in future revisions of the datasheet.




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