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SN74HC27DTE4 데이터시트(PDF) 5 Page - Texas Instruments |
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SN74HC27DTE4 데이터시트(HTML) 5 Page - Texas Instruments |
5 / 14 page PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) 5962-8404201VCA ACTIVE CDIP J 14 1 TBD Call TI Call TI 5962-8404201VDA ACTIVE CFP W 14 1 TBD Call TI Call TI 84042012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type 8404201CA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type 8404201DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/65102BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SN54HC27J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SN74HC27D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC27DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC27DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC27DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC27DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC27DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC27DT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC27DTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC27N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC27NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC27NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC27NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54HC27FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54HC27J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SNJ54HC27W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 Addendum-Page 1 |
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