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NBXSBB021LN1TAG 데이터시트(PDF) 5 Page - ON Semiconductor |
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NBXSBB021LN1TAG 데이터시트(HTML) 5 Page - ON Semiconductor |
5 / 6 page NBXSBA021, NBXSBB021 http://onsemi.com 5 Table 7. RELIABILITY COMPLIANCE Parameter Standard Method Shock Mechanical MIL-STD-833, Method 2002, Condition B Solderability Mechanical MIL-STD-833, Method 2003 Vibration Mechanical MIL-STD-833, Method 2007, Condition A Solvent Resistance Mechanical MIL-STD-202, Method 215 Thermal Shock Environment MIL-STD-833, Method 1011, Condition A Moisture Level Sensitivity Environment MSL1 260 °C per IPC/JEDEC J-STD-020D Figure 4. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D - Termination of ECL Logic Devices.) Receiver Device CLK D CLK D Zo = 50 W Zo = 50 W 50 W 50 W VTT VTT = VDD - 2.0 V NBXSBB021/NBXSBA021 Device Driver 260 217 175 150 Temperature ( °C) temp. 260 °C 20 - 40 sec. max. Time 60 180 sec. 3 °C/sec. max. cooling 6 °C/sec. max. 60 150 sec. reflow peak pre-heat ramp-up Figure 5. Recommended Reflow Soldering Profile |
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