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SN74CBTLV16212DGV 데이터시트(PDF) 1 Page - Texas Instruments

부품명 SN74CBTLV16212DGV
상세설명  LOW-VOLTAGE 24-BIT FET BUS-EXCHANGE SWITCH
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SN74CBTLV16212
LOW-VOLTAGE 24-BIT FET BUS-EXCHANGE SWITCH
SCDS044E – DECEMBER 1997 – REVISED AUGUST 1999
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D 4-Ω Switch Connection Between Two Ports
D Isolation Under Power-Off Conditions
D Break-Before-Make Feature
D ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D Package Options Include Plastic Thin
Shrink Small-Outline (DGG), Thin Very
Small-Outline (DGV), and 300-mil Shrink
Small-Outline (DL) Packages
NOTE:
For tape and reel order entry:
The DGGR package is abbreviated to GR, and
the DGVR package is abbreviated to VR.
description
The SN74CBTLV16212 provides 24 bits of
high-speed bus switching or exchanging. The low
on-state
resistance
of
the
switch
allows
connections to be made with minimal propagation
delay.
The device operates as a 24-bit bus switch or a
12-bit bus exchanger, which provides data
exchanging between the four signal ports via the
data-select (S0, S1, S2) terminals.
The SN74CBTLV16212 is specified by the
break-before-make feature to have no through
current when switching between B ports.
The SN74CBTLV16212 is characterized for
operation from –40
°C to 85°C.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
© 1999, Texas Instruments Incorporated
DGG, DGV, OR DL PACKAGE
(TOP VIEW)
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S0
1A1
1A2
2A1
2A2
3A1
3A2
GND
4A1
4A2
5A1
5A2
6A1
6A2
7A1
7A2
VCC
8A1
GND
8A2
9A1
9A2
10A1
10A2
11A1
11A2
12A1
12A2
S1
S2
1B1
1B2
2B1
2B2
3B1
GND
3B2
4B1
4B2
5B1
5B2
6B1
6B2
7B1
7B2
8B1
GND
8B2
9B1
9B2
10B1
10B2
11B1
11B2
12B1
12B2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.


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