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TL052AMFK 데이터시트(PDF) 6 Page - Texas Instruments |
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TL052AMFK 데이터시트(HTML) 6 Page - Texas Instruments |
6 / 65 page TL05x, TL05xA, TL05xY ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS SLOS178 – FEBRUARY 1997 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TL054 chip information This chip, when properly assembled, displays characteristics similar to the TL054C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. These chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS + – 1OUT 1IN + 1IN – VCC+ (4) (6) (3) (2) (5) (1) – + (7) 2IN + 2IN – 2OUT (11) VCC – + – 3OUT 3IN + 3IN – (13) (10) (9) (12) (8) – + (14) 4OUT 4IN + 4IN – (6) (7) (8) (9) 71 122 CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (11) IS INTERNALLY CONNECTED TO BACKSIDE OF THE CHIP. (1) (2) (3) (4) (5) (6) (7) (8) (9) (10) (11) (12) (13) (14) |
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