전자부품 데이터시트 검색엔진 |
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ISL12058IUZ-T 데이터시트(PDF) 4 Page - Intersil Corporation |
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ISL12058IUZ-T 데이터시트(HTML) 4 Page - Intersil Corporation |
4 / 19 page 4 FN6756.0 June 15, 2009 Absolute Maximum Ratings Thermal Information Voltage on VDD Pin (respect to GND) . . . . . . . . . . . . . . . -0.2V to 4V Voltage on IRQ/FOUT , SCL and SDA Pins (respect to GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.2V to 6V Voltage on X1 and X2 Pins (respect to GND) . . . . . . . . . -0.2V to 4V ESD Rating ((Per MIL-STD-883 Method 3014) Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>4kV Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>350V Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 8 Lead SOIC (Note 3) . . . . . . . . . . . . . 120 N/A 8 Lead MSOP (Note 3). . . . . . . . . . . . . 169 N/A 8 Lead µTDFN (Note 3) . . . . . . . . . . . . 160 N/A 8 Lead TDFN (Notes 4, 5) . . . . . . . . . . 52 7 Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 3. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 4. θ JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 5. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. DC Operating Characteristics – RTC Temperature = -40°C to +85°C unless otherwise stated. SYMBOL PARAMETER CONDITIONS MIN (Note 8) TYP (Note 7) MAX (Note 8) UNITS NOTES VDD Main Power Supply 1.8 3.6 V VDDT Timekeeping Power Supply 1.4 1.8 V IDD1 Standby Supply Current VDD = 3.6V 600 950 nA 6, 12 VDD = 3.0V 500 nA IDD2 Timekeeping Current VDD = 1.8V 400 650 nA 6, 12 VDD = 1.4V 350 nA IDD3 Supply Current With I2C Active at Clock Speed of 400kHz VDD = 3.6V 15 40 µA 6 ILI Input Leakage Current on SCL -100 100 nA ILO I/O Leakage Current on SDA -100 100 nA IRQ/FOUT VOL Output Low Voltage VDD = 1.8V, IOL = 3mA 0.4 V Serial Interface Specifications Over the recommended operating conditions unless otherwise specified. SYMBOL PARAMETER TEST CONDITIONS MIN (Note 8) TYP (Note 7) MAX (Note 8) UNITS NOTES SERIAL INTERFACE SPECS VIL SDA and SCL Input Buffer LOW Voltage -0.3 0.3 x VDD V VIH SDA and SCL Input Buffer HIGH Voltage 0.7 x VDD 5.5 V Hysteresis SDA and SCL Input Buffer Hysteresis 0.04 x VDD V VPULLUP Maximum Pull-up Voltage on SDA during I2C Communication VDD + 2 V 11 VOL SDA Output Buffer LOW Voltage, Sinking 3mA VDD > 1.8V, VPULLUP = 5.0V 0 0.4 V Cpin SDA and SCL Pin Capacitance TA = +25°C, f = 1MHz, VDD = 5V, VIN =0V, VOUT = 0V 10 pF 9, 10 fSCL SCL Frequency 400 kHz ISL12058 |
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