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FSB50550U 데이터시트(PDF) 1 Page - Fairchild Semiconductor

부품명 FSB50550U
상세설명  Smart Power Module (SPM짰)
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제조업체  FAIRCHILD [Fairchild Semiconductor]
홈페이지  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

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©2009 Fairchild Semiconductor Corporation
1
www.fairchildsemi.com
FSB50550U Rev. A
February 2009
FSB50550U
Smart Power Module (SPM®)
Features
•500V RDS(on)=1.4Ω(max) 3-phase FRFET inverter including
high voltage integrated circuit (HVIC)
• 3 divided negative dc-link terminals for inverter current sens-
ing applications
• HVIC for gate driving and undervoltage protection
• 3/5V CMOS/TTL compatible, active-high interface
• Optimized for low electromagnetic interference
• Isolation voltage rating of 1500Vrms for 1min.
General Description
FSB50550U is a tiny smart power module (SPM®) based on
FRFET technology as a compact inverter solution for small
power motor drive applications such as fan motors and water
suppliers. It is composed of 6 fast-recovery MOSFET (FRFET),
and 3 half-bridge HVICs for FRFET gate driving. FSB50550U
provides low electromagnetic interference (EMI) characteristics
with optimized switching speed. Moreover, since it employs
FRFET as a power switch, it has much better ruggedness and
larger safe operation area (SOA) than that of an IGBT-based
power module or one-chip solution. The package is optimized
for the thermal performance and compactness for the use in the
built-in motor application and any other application where the
assembly space is concerned. FSB50550U is the most solution
for the compact inverter providing the energy efficiency,
compactness, and low electromagnetic interference.
Absolute Maximum Ratings
Symbol
Parameter
Conditions
Rating
Units
VPN
DC Link Input Voltage,
Drain-source Voltage of each FRFET
500
V
ID25
Each FRFET Drain Current, Continuous
TC = 25°C
2.0
A
ID80
Each FRFET Drain Current, Continuous
TC = 80°C
1.5
A
IDP
Each FRFET Drain Current, Peak
TC = 25°C, PW < 100μs
5
A
PD
Maximum Power Dissipation
TC = 25°C, Each FRFET
14.5
W
VCC
Control Supply Voltage
Applied between VCC and COM
20
V
VBS
High-side Bias Voltage
Applied between VB(U)-U, VB(V)-V, VB(W)-W
20
V
VIN
Input Signal Voltage
Applied between IN and COM
-0.3 ~ VCC+0.3
V
TJ
Operating Junction Temperature
-40 ~ 150
°C
TSTG
Storage Temperature
-50 ~ 150
°C
RθJC
Junction to Case Thermal Resistance
Each FRFET under inverter operating con-
dition (Note 1)
8.6
°C/W
VISO
Isolation Voltage
60Hz, Sinusoidal, 1 minute, Connection
pins to heatsink
1500
Vrms


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