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STM32F103RBH7TR 데이터시트(Datasheet) 82 Page - STMicroelectronics

부품명 STM32F103RBH7TR
상세내용  Medium-density performance line ARM-based 32-bit MCU with 64 or 128 KB Flash, USB, CAN, 7 timers, 2 ADCs, 9 communication interfaces
PDF  92 Pages
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제조사  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
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Package characteristics
STM32F103x8, STM32F103xB
82/92
Doc ID 13587 Rev 11
6.2
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 9: General operating conditions on page 35.
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max × JA)
Where:
TA max is the maximum ambient temperature in C,
JA is the package junction-to-ambient thermal resistance, in C/W,
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = (VOL × IOL) + ((VDD – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
6.2.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Table 56.
Package thermal characteristics
Symbol
Parameter
Value
Unit
JA
Thermal resistance junction-ambient
LFBGA100 - 10 × 10 mm / 0.8 mm pitch
44
°C/W
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
46
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
45
Thermal resistance junction-ambient
TFBGA64 - 5 × 5 mm / 0.5 mm pitch
65
Thermal resistance junction-ambient
LQFP48 - 7 x 7 mm / 0.5 mm pitch
55
Thermal resistance junction-ambient
VFQFPN 36 - 6 × 6 mm / 0.5 mm pitch
18




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