전자부품 데이터시트 검색엔진 |
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LA190B-DBK-2-PF 데이터시트(PDF) 6 Page - LIGITEK electronics co., ltd. |
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LA190B-DBK-2-PF 데이터시트(HTML) 6 Page - LIGITEK electronics co., ltd. |
6 / 6 page Page 5/5 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference Standard Test Item Operating Life Test Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Reliability Test: LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 High Temperature Storage Test Low Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles Thermal Shock Test The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this test is the resistance of the device under tropical for hours. This test intended to see soldering well performed or not. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. PART NO. LA190B/DBK-2-PF |
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