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CBA3216GM301N4 데이터시트(PDF) 4 Page - SAMWHA ELECTRIC

부품명 CBA3216GM301N4
상세설명  BEADS ARRAY
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제조업체  SAMWHA [SAMWHA ELECTRIC]
홈페이지  http://www.samwha.com
Logo SAMWHA - SAMWHA ELECTRIC

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SAMWHA ELECTRONICS CO., LTD
Reliability & Test Condition
http://www.samwha.com/chip
This description in the this catalogue is subject to change without notice
Temperature : 125
± 3 ℃
Applied current : rated current
Time : 1000
± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
High temperature
load resistance
Temperature : 40
± 2 ℃
Humidity : 90
± 2 % RH
Time : 500
± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
Humidity
resistance
Preheat temperature : 150 ℃
Preheat time : 60 sec.
Solder temperature : 245
± 5 ℃
Soldering time : 10 sec. max.
(Reflow soldering profile)
More than 50% of the terminal electrode
shall be covered with new solder
Reflow soldering
at packing condition
40 ℃ max., 70% RH max.
Storage
temperature range
Preheat temperature : 100 ~ 150 ℃
Preheat time : 60 sec.
Solder temperature : 245
± 5 ℃
Soldering time : 10
± 1 sec.
More than 90% of the terminal electrode shall be
covered with new solder
Solderability
Preheat temperature : 100 ~ 150 ℃
Preheat time : 60 sec.
Solder temperature : 270
± 10 ℃
Soldering time : 10
± 0.5 sec.
1. No damage such as cracks should be
caused in chip element
2. More than 75% of the terminal electrode
shall be covered with new solder
3. Impedance shall not change
more than ±30 %
Resistance to
soldering heat
Temperature : 125
± 3 ℃
Time : 500
± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
1. No mechanical damage
2. Impedance shall not change more than ±30 %
High temperature
resistance
-
- 55 ℃ ~ + 125 ℃
Operating
temperature range
Test Conditions
Requirements
Item
ST ≥
CT
1
3
CT
ST
DPS-081104
CHIP BEADS ARRAY


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