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1PS66SB82_1PS88SB82_4 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 04 — 13 January 2010 3 of 10 NXP Semiconductors 1PS66SB82; 1PS88SB82 15 V, 30 mA low Cd Schottky barrier diodes 6. Thermal characteristics [1] For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. Nomograms for determining the reverse power losses PR and IF(AV) rating will be available on request. [2] Refer to SOT666 standard mounting conditions. [3] Reflow soldering is the only recommended soldering method. [4] Refer to SOT363 (SC-88) standard mounting conditions. 7. Characteristics [1] Pulse test: tp ≤ 300 μs; δ≤ 0.02. Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air SOT666 [2][3] --700 K/W SOT363 [3][4] --416 K/W Table 8. Characteristics Tamb =25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VF forward voltage see Figure 1 IF = 1 mA - - 340 mV IF = 30 mA - - 700 mV IR reverse current -- 0.2 μA rdif differential resistance IF = 5 mA; f = 1 kHz; see Figure 3 -12 - Ω Cd diode capacitance VR = 0 V; f = 1 MHz; see Figure 4 -1 - pF |
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